Cypress CY7C6431x, CY7C64345, CY7C6435x manual Package Handling, Pin 7 x 7 x 0.9 mm QFN

Page 25

CY7C6431x

CY7C64345, CY7C6435x

Figure 11. 48-Pin (7 x 7 x 0.9 mm) QFN

001-13191 *C

Package Handling

Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving the factory. A label on the package has details about the actual bake temperature and the minimum bake time to remove this moisture. The maximum bake time is the aggregate time that the parts exposed to the bake temperature. Exceeding this exposure may degrade device reliability.

Table 22.Package Handling

Parameter	Description	Minimum	Typical	Maximum	Unit
TBAKETEMP	Bake Temperature		125	See package label	oC
TBAKETIME	Bake Time	See package label		72	hours

Document Number: 001-12394 Rev *G

Page 25 of 28

[+] Feedback

Image 25

Contents EnCoRe V Block Diagram FeaturesCypress Semiconductor Corporation 198 Champion Court Getting Started Functional OverviewEnCoRe V Core Additional System ResourcesPSoC Designer Software Subsystems Development ToolsDesigning with PSoC Designer Configure ComponentsSelect Components Generate, Verify, and DebugAcronyms Used Document ConventionsUnits of Measure Numeric NamingPin Part Pinout Pin ConfigurationPin Part Pinout QFN Pin No Type Name Description QFN Pin Part Pinout QFN Pin No Type Pin Name Description CY7C64355/CY7C64356 48-Pin enCoRe V USB DeviceCY7C6431x Register Conventions Register ReferenceRegister Mapping Tables Register Conventions DescriptionRegister Map Bank 0 Table User Space Name Addr 0,Hex AccessName Addr 1,Hex Access Register Map Bank 1 Table Configuration SpaceUnits of Measure Symbol Unit of Measure Electrical SpecificationsINL ADC Electrical SpecificationsDC Electrical Characteristics Electrical CharacteristicsDC Chip Level Specifications Absolute Maximum RatingsDC General Purpose IO Specifications DC POR and LVD Specifications DC Programming Specifications AC Electrical CharacteristicsAC Chip Level Specifications 160 175 AC External Clock Specifications AC General Purpose I/O SpecificationsAC SPI Specifications AC Programming SpecificationsAC SPI Specifications Symbol Description Min Typ Max Units Definition of Timing for Fast/Standard Mode on the I2C Bus AC I2C SpecificationsPackaging Dimensions Package DiagramPin 5 x 5 x 0.55 mm QFN Pin 7 x 7 x 0.9 mm QFN Package HandlingThermal Impedances Solder Reflow Peak TemperatureOrdering Information TYJ/ARI Document HistoryWorldwide Sales and Design Support Products PSoC Solutions Sales, Solutions, and Legal Information