Intel 315889-002 manual Time Duration s

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Output Voltage Requirements

The continuous load current (ICCTDC) can also be referred to as the Thermal Design Current (TDC). It is the sustained DC equivalent current that the processor is capable of drawing indefinitely and defines the current that is used for the voltage regulator temperature assessment. At TDC, switching FETs may reach maximum allowed temperatures and may heat the baseboard layers and neighboring components. The envelope of the system operating conditions, establishes actual component and baseboard temperatures. This includes voltage regulator layout, processor fan selection, ambient temperature, chassis configuration, etc. To avoid heat related failures, baseboards should be validated for thermal compliance under the envelope of the system’s operating conditions. It is proposed that voltage regulator thermal protection be implemented for all designs (Section 6.2).

The maximum load current (ICCMAX) represents the maximum peak current that the processor is capable of drawing. It is the maximum current the VRM/EVRD must be electrically designed to support without tripping any protection circuitry.

The maximum step load current (IccStep) is the max dynamic step load that the processor is expected to impose on its Vcc power rail within the Iccmin and Iccmax range, where the Iccmin is the processor’s min load, constituted by its leakage current.

The amount of time required by the VR to supply current to the processor is dependent on the processor’s operational activity. As previously mentioned, the processor is capable of drawing IccTDC indefinitely; therefore, the VR must be able to supply (ICCTDC) indefinitely. Refer to Figure 2-1for the time durations required by the VR to supply current for various processor loads.

It is expected that the maximum load current (ICCMAX) can be drawn for periods up to 10 ms. Further, it is expected that the load current averaged over a period of

100 seconds or greater, will be equal to or less than the thermal design current

(ICCTDC).

Figure 2-1. VRM/EVRD 11.0 Load Current vs. Time

Icc MAX

 

 

 

 

 

Sustained Current (A)

 

 

 

 

 

Icc TDC

 

 

 

 

 

0.01

0.10

1.00

10.00

100.0

1000.0

 

 

Time Duration (s)

 

 

Table 2-2shows the ICC guidelines for any flexible motherboard (FMB) frequencies supported by the VRM/EVRD 11.0 in Table 1-1. For designers who choose to design their VR thermal solution to the ICCTDC current, it is recommended that voltage regulator thermal protection circuitry be implemented (see Section 6.2).

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315889-002

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Contents Design Guidelines 315889-002 Contents Figures Tables315889-002 Revision History Rev # Description Rev. DateRevision Project Document State Projects Covered 315889-002 Applications Introduction and TerminologyVRM/EVRD 11.0 Supported Platforms and Processors Guideline Categories Guideline CategoriesProcessor VID signal implementation Output Voltage RequirementsVoltage and Current Required Time Duration s Load Line Definitions Required Icc GuidelinesVIDSelect, LL1, LL0 Codes Sheet 1 Load Line / Processors SelectCC Tolerance / Die Load Line Units Select Voltage Tolerance Required VIDSelect, LL1, LL0 Codes Sheet 2Mode Processor VCC Overshoot Required Impedance vs. Frequency ExpectedVR BW Processor Power Sequencing Required Stability RequiredImpedance ZLL Measurement Parameter Limits Timing Min Default Max Remarks Startup Sequence Timing Parameters Sheet 1Dynamic Voltage Identification D-VID Startup Sequence Timing Parameters Sheet 2Processor Transition States Overshoot at Turn-On or Turn-Off Required Output Filter Capacitance RequiredPolymer PWL Coefficient Quantity Value / Description560µF/2.5V/20%/ Oscon 22µF/6.3V/20%/ X5R /1206 Mlcc Quantity Value Tolerance Temperature Motherboard Socket & PackageShut-Down Response Required Control Signals Output Enable Outen RequiredOuten Specifications VID 60 SpecificationsExtended VR 10 Voltage Identification VID Table 400 mV 200 mV 100 mV 50 mV 25 mV 12.5 mVDifferential Remote Sense VOSEN+ VR 11.0 Voltage Identification VID TableLGA LL0, LL1, VIDSelect Specifications Load Line Select LL0, LL1, VIDSelectVID Bit Mapping Control Signals Input Voltage and Current Input Voltages ExpectedLoad Transient Effects on Input Current Input Voltage and Current Processor Voltage Output Protection Over-Voltage Protection OVP ExpectedOver-Current Protection OCP Expected Processor Voltage Output Protection Output Indicators VRReady SpecificationsVRhot# Specifications Voltage Regulator Ready VRReady RequiredLoad Indicator Output LoadCurrent VRMpres# SpecificationsVRMID# Specifications VRM Present VRMpres# ExpectedVRM 11.0 and Platform Present Detection 315889-002 VRM Connector Expected VRM Tyco/Elcon Connector KeyingVRM 11.0 Connector Part Number and Vendor Name VRM Mechanical GuidelinesVRM 11.0 Connector Pin Descriptions Name Type DescriptionMechanical Dimensions Proposed VRM 11.0 Pin AssignmentsVRM 11.0 Module and Connector Operating Temperature Proposed VRM Board Temperature RequiredNon-Operating Temperature Proposed Environmental ConditionsSafety Proposed Altitude ProposedElectrostatic Discharge Proposed Shock and Vibration ProposedManufacturing Considerations Lead Free Pb FreeManufacturing Considerations Zf Constant Output Impedance Design Introduction ProposedFigure A-2. Zf Network Plot with 1.25 mΩ Load Line Zf Constant Output Impedance Design Voltage Transient Tool VTT Zf Theory = FFT V t FFT I tVTT Zf Measurement Method ResultsZf Constant Output Impedance Design 10uF 22uF Output Decoupling Design Procedure

315889-002 specifications

The Intel 315889-002 is a highly regarded processor that has made significant contributions to the computing landscape. As part of Intel's dedicated line of CPUs, this model is engineered to deliver robust performance and efficiency for a range of applications, from personal computing to enterprise solutions. Features of the Intel 315889-002 include its multi-core architecture, which allows for better multitasking capabilities. With multiple cores working simultaneously, users can run multiple applications without experiencing noticeable lag, leading to a smoother overall experience.

One of the standout technologies incorporated in the Intel 315889-002 is Intel Turbo Boost Technology. This technology intelligently increases the processor's clock speed to enhance performance when required while ensuring energy efficiency during lighter loads. This feature is particularly beneficial in environments where performance needs can fluctuate, such as in gaming or intensive data analysis.

The processor supports a wide variety of instruction sets, enhancing its compatibility with various software and applications. Additionally, it runs on a highly efficient microarchitecture that optimizes processing cycles, reducing power consumption and heat generation. This is crucial not only for maintaining system stability but also for prolonging the lifespan of the hardware.

Another notable characteristic is its built-in security features, including Intel Software Guard Extensions (SGX) which create isolated execution environments for sensitive operations. This is particularly important in today's digital age, where data security is a top priority for both individuals and organizations.

The Intel 315889-002 is also equipped with Integrated Graphics, which offloads graphical tasks from the CPU, enabling better performance in applications that require visual rendering without needing a dedicated graphics card. This feature is ideal for users who require decent graphics capabilities without the added expense of additional hardware.

Overall, the Intel 315889-002 stands out as a well-rounded processor that combines performance, efficiency, security, and versatility. Its advanced technologies and thoughtful design make it suitable for a wide variety of users, from gamers to professionals, seeking reliable and efficient computing solutions.