![](/images/new-backgrounds/1306619/306619367x1.webp)
Category | Description | P/N |
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MEMORY |
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| MEMORY SAMSUNG | KN.1GB0B.016 |
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| MEMORY SAMSUNG | KN.1GB0B.033 |
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| MEMORY KINGSTON | KN.1GB07.003 |
| ACR128X64D2S800C6 LF 128*8 0.065UM |
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| MEMORY SAMSUNG | KN.2GB0B.018 |
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| MEMORY KINGSTON | KN.2GB07.003 |
| ACR256X64D2S800C6 LF 128*8 0.065UM |
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| MEMORY SAMSUNG | KN.1GB0B.035 |
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| MEMORY HYNIX | KN.1GB0G.026 |
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| MEMORY KINGSTON | KN.1GB07.004 |
| 1GB ACR128X64D3S1333C9 LF 128*8 0.065UM |
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| MEMORY HYNIX | KN.2GB0G.018 |
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HEATSINK |
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| THERMAL MODULE W/FAN | 60.SDE02.006 |
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| THERMAL MODULE W/FAN FOR N550 CPU | 60.SDE02.007 |
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MICROPHONE |
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| MIC SET FOR W/O 3G | 23.SDE02.001 |
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| MIC SET FOR W/3G | 23.SDU02.001 |
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| SPEAKER R+L | 23.SDE02.002 |
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MISCELLANEOUS |
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| LCD SCREW MYLAR | 47.SDE02.001 |
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| LOW SIM CARD | 47.SDE02.002 |
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| LOW SIM CARD | 47.SDG02.001 |
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174 | Chapter 6 |