CHAPTER 6: FRU
Processor | CPU Intel Core i3 330M PGA 2.13G 35W Arrandale, TJ90, VT, 3M L3 | KC.33001.DMP |
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| CPU Intel Core i3 350M PGA 2.26G 35W Arrandale, TJ90, VT, 3M L3 | KC.35001.DMP |
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| CPU Intel Core i5 430M PGA 2.26G ARD, up to SC 2.53G, 3M L3 | KC.43001.DMP |
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| CPU Intel Core i5 520M 2.4G 3M | KC.52001.DMP |
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| CPU Intel Core i5 540M 2.53G 3M | KC.54001.DMP |
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| CPU Intel Core i7 620M PGA 2.66G 4M | KC.62001.DMP |
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Memory | Memory ELPIDA | KN.1GB09.012 |
| 0.065um |
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| Memory HYNIX | KN.1GB0G.025 |
| 64*16 0.055um |
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| Memory MICRON | KN.1GB04.015 |
| 128*8 0.065um |
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| Memory SAMSUNG | KN.1GB0B.028 |
| 64*16 0.055um |
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| Memory ELPIDA | KN.2GB09.006 |
| 0.065um |
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| Memory HYNIX | KN.2GB0G.014 |
| 128*8 0.055um |
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| Memory MICRON | KN.2GB04.015 |
| 128*8 0.065um |
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| Memory SAMSUNG | KN.2GB0B.012 |
| 128*8 0.055um |
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| Memory NONE | KN.4GB00.001 |
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| Memory ELPIDA | KN.4GB09.001 |
| 0.055um |
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VGA chip | AMD MADISON_PRO 40nm 29mm*29mm M2 package | KI.23200.169 |
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| AMD PARK_XT 40nm 29mm*29mm M2 package | KI.23200.162 |
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| UMA (Intel) | KI.23200.038 |
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| NVIDIA N11MGE1 40nm 29mm*29mm | KI.23200.160 |
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VRAM | VRAM SAMSUNG Graphic DDRIII 800 1Gb | VR.1GB0B.006 |
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| VRAM HYNIX Graphic DDRIII 800 1Gb | VR.1GB0G.004 |
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| KI.23300.018 | |
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| KI.23300.019 | |
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| VRAM ATI Graphic DDRIII 800 1Gb | VR.1GB0T.002 |
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Core logic | NB Chipset Intel CS BD82HM55 | KI.G5501.002 |
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LAN chipset | Broadcom BCM57780 | NI.22400.047 |
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Audio codec | Realtek Audio Codec ALC272X | LZ.21000.045 |
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WLAN module | Foxconn Wireless LAN Atheros HB93 2x2 BGN (HM) | NI.23600.062 |
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| Liteon Wireless LAN Atheris HB93 2x2 BGN (HM) WN6602AH | NI.23600.063 |
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