CY7C1380DV25, CY7C1380FV25
CY7C1382DV25, CY7C1382FV25
Document #: 38-05546 Rev. *E Page 8 of 29
ADSP triggered write accesses require two clock cycles to
complete. If GW is asserted LOW on the second clock rise, the
data presented to the DQs inputs is written into the
corresponding address location in the memory array. If GW is
HIGH, then the write operation is controlled by BWE and BWX
signals.
The CY7C1380DV25/CY7C1382DV25/CY7C1380FV25/
CY7C1382FV25 provides byte write capability that is
described in the write cycle descriptions table. Asserting the
byte write enable input (BWE) with the selected byte write
(BWX) input, will selectively write to only the desired bytes.
Bytes not selected during a byte write operation will remain
unaltered. A synchronous self timed write mechanism has
been provided to simplify the write operations.
The CY7C1380DV25/CY7C1382DV25/CY7C1380FV25/
CY7C1382FV25 is a common IO device, the output enable
(OE) must be deserted HIGH before presenting data to the
DQs inputs. Doing so will tri-state the output drivers. As a
safety precaution, DQs are automatically tri-stated whenever
a write cycle is detected, regardless of the state of OE.
Single Write Accesses Initiated by ADSC
ADSC write accesses are initiated when the following
conditions are satisfied: (1) ADSC is asserted LOW, (2) ADSP
is deasserted HIGH, (3) CE1, CE2, CE3 are all asserted active,
and (4) the appropriate combination of the write inputs (GW,
BWE, and BWX) are asserted active to conduct a write to the
desired byte(s). ADSC triggered write accesses require a
single clock cycle to complete. The address presented to A is
loaded into the address register and the address
advancement logic while being delivered to the memory array.
The ADV input is ignored during this cycle. If a global write is
conducted, the data presented to the DQs is written into the
corresponding address location in the memory core. If a byte
write is conducted, only the selected bytes are written. Bytes
not selected during a byte write operation will remain
unaltered. A synchronous self timed write mechanism has
been provided to simplify the write operations.
The CY7C1380DV25/CY7C1382DV25/CY7C1380FV25/
CY7C1382FV25 is a common IO device, the output enable
(OE) must be deserted HIGH before presenting data to the
DQs inputs. Doing so will tri-state the output drivers. As a
safety precaution, DQs are automatically tri-stated whenever
a write cycle is detected, regardless of the state of OE.
Burst Sequences
The CY7C1380DV25/CY7C1382DV25/CY7C1380FV25/
CY7C1382FV25 provides a two-bit wraparound counter, fed
by A1: A0, that implements either an interleaved or linear burst
sequence. The interleaved burst sequence is designed
specifically to support Intel Pentium applications. The linear
burst sequence is designed to support processors that follow
a linear burst sequence. The burst sequence is user selectable
through the MODE input.
Asserting ADV LOW at clock rise will automatically increment
the burst counter to the next address in the burst sequence.
Both read and write burst operations are supported.
Sleep Mode
The ZZ input pin is an asynchronous input. Asserting ZZ
places the SRAM in a power conservation sleep mode. Two
clock cycles are required to enter into or exit from this sleep
mode. While in this mode, data integrity is guaranteed.
Accesses pending when entering the sleep mode are not
considered valid nor is the completion of the operation
guaranteed. The device must be deselected prior to entering
the sleep mode. CE1, CE2, CE3, ADSP, and ADSC must
remain inactive for the duration of tZZREC after the ZZ input
returns LOW.
Interleaved Burst Address Table
(MODE = Floating or VDD)
First
Address
A1: A0
Second
Address
A1: A0
Third
Address
A1: A0
Fourth
Address
A1: A0
00 01 10 11
01 00 11 10
10 11 00 01
11 10 01 00
Linear Burst Address Table
(MODE = GND)
First
Address
A1: A0
Second
Address
A1: A0
Third
Address
A1: A0
Fourth
Address
A1: A0
00 01 10 11
01 10 11 00
10 11 00 01
11 00 01 10
ZZ Mode Electrical Characteristics
Parameter Description Test Conditions Min. Max. Unit
IDDZZ Sleep mode standby current ZZ > VDD – 0.2V 80 mA
tZZS Device operation to ZZ ZZ > VDD – 0.2V 2tCYC ns
tZZREC ZZ recovery time ZZ < 0.2V 2tCYC ns
tZZI ZZ Active to sleep current This parameter is sampled 2tCYC ns
tRZZI ZZ Inactive to exit sleep current This parameter is sampled 0 ns
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