CY7C1386D, CY7C1386F
CY7C1387D, CY7C1387F
Document Number: 38-05545 Rev. *E Page 19 of 30
Capacitance [19]
Parameter Description Test Conditions 100 TQFP
Max.
119 BGA
Max
165 FBGA
Max Unit
CIN Input Capacitance TA = 25°C, f = 1 MHz,
VDD = 3.3V
VDDQ = 2.5V
5 8 9 pF
CCLK Clock Input Capacitance 5 8 9 pF
CIO Input/Output Capacitance 5 8 9 pF
Thermal Resistance [19]
Parameter Description Test Conditions 100 TQFP
Package
119 BGA
Package
165 FBGA
Package Unit
ΘJA Thermal Resistance
(Junction to Ambient)
Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, in accordance with
EIA/JESD51.
28.66 23.8 20.7 °C/W
ΘJC Thermal Resistance
(Junction to Case)
4.08 6.2 4.0 °C/W
AC Test Loads and Waveforms
OUTPUT
R = 317Ω
R = 351Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
V
T
= 1.5V
3.3V ALL INPUT PULSES
VDDQ
GND
90%
10%
90%
10%
≤1 ns ≤1 ns
(c)
OUTPUT
R = 1667Ω
R = 1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VT= 1.25V
2.5V ALL INPUT PULSES
VDDQ
GND
90%
10%
90%
10%
≤1 ns ≤1 ns
(c)
3.3V IO Test Load
2.5V IO Test Load
Note
19.Tested initially and after any design or process change that may affect these parameters.
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