Package Diagrams | Cypress CY7C1387D, CY7C1386F, CY7C1387F, CY7C1386D

CY7C1386D, CY7C1386F

CY7C1387D, CY7C1387F

Package Diagrams

Figure 1. 100-Pin Thin Plastic Quad Flat pack (14 x 20 x 1.4 mm) (51-85050)

16.00±0.20

14.00±0.10

1.40±0.05

100	81
1	80

22.00±0.20

20.00±0.10

30

31

0.30±0.08

0.65	12° ±1°
TYP.	(8X)

51

50

SEE DETAIL

A

0.20 MAX.

1.60 MAX.

R 0.08 MIN. 0.20 MAX.

0.25

0° MIN.

SEATING PLANE

STAND-OFF

0.05 MIN.NOTE:

0.15 MAX.

0.10

GAUGE PLANE

0° -7°

0.60±0.15

1.00 REF.

R 0.08 MIN. 0.20 MAX.

0.20 MIN.

DETAIL A

1.JEDEC STD REF MS-026

2.BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH

3.DIMENSIONS IN MILLIMETERS

51-85050-*B

Document Number: 38-05545 Rev. *E

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Cypress CY7C1387D, CY7C1386F, CY7C1387F, CY7C1386D manual Package Diagrams, Pin Thin Plastic Quad Flat pack 14 x 20 x 1.4 mm

Contents

Cypress Semiconductor Corporation FeaturesSelection Guide 250 MHz 200 MHz 167 MHz Unit Logic Block Diagram CY7C1387D/CY7C1387F 3 1M x Logic Block Diagram CY7C1386D/CY7C1386F 3 512K x Pin Configurations Pin Tqfp Pinout 3 Chip Enables CY7C1386D 512K XCY7C1387D 1M x Pin Configurations Ball BGA Pinout 1 Chip Enable Pin Configurations Ball Fbga Pinout 3 Chip Enable Byte write select inputs, active LOW. Qualified with Power supply inputs to the core of the devicePin Definitions Name Description Functional Overview Interleaved Burst Address Table Mode = Floating or VDD Linear Burst Address Table Mode = GNDZZ Mode Electrical Characteristics Operation Add. Used Truth Table for Read/Write 6 Function CY7C1386D/CY7C1386FFunction CY7C1387D/CY7C1387F TAP Controller Block Diagram TAP Controller State Diagram TAP Instruction Set Bypass Register TAP Timing TAP AC Switching Characteristics GND VIN Vddq 3V TAP AC Test Conditions5V TAP AC Test Conditions 3V TAP AC Output Load Equivalent Register Name Bit Size Identification Register DefinitionsScan Register Sizes Identification Codes Ball BGA Boundary Scan Order 14 Bit # Ball IDInternal G10 F10 Internal A10 B10M11 M10 Range Ambient Electrical CharacteristicsMaximum Ratings Operating Range Capacitance Thermal ResistanceAC Test Loads and Waveforms Description 250 200 167 Unit Parameter Min Switching Characteristics Over the Operating Range 20 Read Cycle Timing Switching Waveforms Adsc Write Cycle Timing 26 Read/Write Cycle Timing 26, 28 ZZ Mode Timing 30 Ordering Information CY7C1386D, CY7C1386F CY7C1387D, CY7C1387F Pin Thin Plastic Quad Flat pack 14 x 20 x 1.4 mm Package Diagrams Ball BGA 14 x 22 x 2.4 mm Ball Fbga 13 x 15 x 1.4 mm Issue Date Orig. Description of Change Document HistoryDocument Number