CY7C1386D, CY7C1386F
CY7C1387D, CY7C1387F
Package Diagrams (continued)
Figure 3. 165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180)
15.00±0.10 | 15.00±0.10 |
TOP VIEW
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| TOP VIEW |
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| PIN 1 CORNER |
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| PIN 1 CORNER |
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| 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 |
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| 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 |
B | A |
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CB
DC
ED
FE
GF
HG
JH
KJ
15.00±0.10
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| BOTTOM VIEW |
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| BOTTOM VIEWPIN 1 CORNER |
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| Ø0.05 M C |
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| Ø0.05 M C |
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| Ø0.25 M C A B |
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| Ø0.50 | .25 M C A B |
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| (165X) |
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| +0.14 |
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| 11 | 10 | 9 | 8 | 7 | 6 | 5 | Ø0.50 | (165X) |
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| 4 | 3 | 2 | 1 |
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| 11 | 10 | 9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1A | A | |
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| C | |
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| 1.00 |
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| D | C | |||
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| E | D |
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| F | E |
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| G | F |
14.00 |
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| H | G | |
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| 14.00 |
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15.00±0.10 |
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| J | H | ||||
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| K | J |
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A
A
B
LK
ML
NM
PN
RP R
| 13.00±0.10 |
B | 13.00±0.10 |
A
| 7.00 | 7.00 | |
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A
B
B
0.15(4X)
1.00
5.00
1.00
5.00
10.00
10.00
13.00±0.10
13.00±0.10
LK
ML
NM
PN
RP R
0.25 C | 00.25.53±0C .05 | 0.53±0.05 |
| 0.36 | C |
| 0.36 |
1.40MAX. |
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| 0.15C MAX. | 0.15 C | ||
| 1.40 | |||
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SEATING PLANE
SEATING PLANE
C
0.35±0.06 | 0.35±0.06 |
0.15(4X)
NOTES :
SOLDERNOTESPAD TYPE: : NON-SOLDER MASK DEFINED (NSMD)
PACKAGESOLDWEIGHTR PAD: 0TYPE.475g:
JEDEC REFERENCEPACKAGE WEIGHT:
PACKAGEJEDECCODEREFERENCE: BB0AC :
PACKAGE CODE : BB0AC
Intel and Pentium are registered trademarks, and i486 is a trademark of Intel Corporation. PowerPC is a trademark of IBM Corporation. All product and company names mentioned in this document are the trademarks of their respective holders.
Document Number: | Page 29 of 30 |
© Cypress Semiconductor Corporation,
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