Cypress CY7C1386D, CY7C1386F, CY7C1387D, CY7C1387F

CY7C1386D, CY7C1386F

CY7C1387D, CY7C1387F

Document Number: 38-05545 Rev. *E Page 28 of 30

Figure 2. 119-Ball BGA (14 x 22 x 2.4 mm) (51-85115)

Package Diagrams (continued)

51-85115-*B

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Contents

Main 18-Mbit (512K x 36/1 Mbit x 18) Pipelined DCD Sync SRAM CY7C1386D, CY7C1386F CY7C1387D, CY7C1387F Features Functional Description Selection Guide Logic Block Diagram CY7C1386D/CY7C1386F [3] (512K x 36) Logic Block Diagram CY7C1387D/CY7C1387F E PIPELINED ENABLE OUTPUT REGISTERS INPUT REGISTERS CY7C1386D, CY7C1386F CY7C1387D, CY7C1387F Document Number: 38-05545 Rev. *E Page 3 of 30 Pin Configurations CY7C1386D (512K X 36) CY7C1387D (1M x 18) Pin Configurations CY7C1386F (512K x 36) CY7C1387F (1M x 18) 119-Ball BGA Pinout (1 Chip Enable) Pin Configurations 165-Ball FBGA Pinout (3 Chip Enable) CY7C1386D (512K x 36) CY7C1387D (1M x 18) 2345671 A B C D E F G H J K L M N P R 891011 CY7C1386D, CY7C1386F Pin Definitions CY7C1386D, CY7C1386F CY7C1387D, CY7C1387F Functional Overview Pin Definitions CY7C1386D, CY7C1386F CY7C1387D, CY7C1387F Interleaved Burst Address Table (MODE = Floating or VDD) Linear Burst Address Table (MODE = GND) ZZ Mode Electrical Characteristics Truth Table Truth Table for Read/Write Truth Table for Read/Write IEEE 1149.1 Serial Boundary Scan (JTAG) TAP Controller State Diagram TAP Controller Block Diagram Page CY7C1386D, CY7C1386F CY7C1387D, CY7C1387F TAP Ti min g TAP AC Switching Characteristics 3.3V TAP AC Test Conditions 3.3V TAP AC Output Load Equivalent 2.5V TAP AC Test Conditions 2.5V TAP AC Output Load Equivalent TAP DC Electrical Characteristics And Operating Conditions Identification Register Definitions Scan Register Sizes Identification Codes 119-Ball BGA Boundary Scan Order[14, 15] 165-Ball BGA Boundary Scan Order[14, 16] Maximum Ratings Operating Range Electrical Characteristics Capacitance Thermal Resistance AC Test Loads and Waveforms Switching Characteristics Switching Waveforms Read Cycle Timing Write Cycle Timing Read/Write Cycle Timing ZZ Mode Timing Page Ordering Information Package Diagrams Figure 1. 100-Pin Thin Plastic Quad Flat pack (14 x 20 x 1.4 mm) (51-85050) A Page Figure 3. 165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180) SOLDERPAD TYPE : NON-SOLDER MASK DEFINED (NSMD) 1.40MAX. 51-85180-*A Package Diagrams - NOTES : PACKAGE WEIGHT : 0.475g JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE CODE : BB0AC NOTES: PACKAGEWEIGHT : 0.475g JEDECREFERENCE : MO-216 / DESIGN 4.6C PACKAGECODE : BB0AC 51-85180-*A Document History Page