Cypress CY7C1470BV25, CY7C1474BV25 Capacitance, Thermal Resistance, AC Test Loads and Waveforms

CY7C1470BV25

CY7C1472BV25, CY7C1474BV25

Electrical Characteristics

Over the Operating Range[12, 13] (continued)

Parameter	Description	Test Conditions		Min	Max	Unit
ISB3	Automatic CE	Max. VDD, Device Deselected,	4.0-ns cycle, 250 MHz		200	mA
	Power Down	VIN ≤ 0.3V or
			5.0-ns cycle, 200 MHz		200	mA
	Current—CMOS Inputs	VIN > VDDQ − 0.3V,
		f = fMAX = 1/tCYC	6.0-ns cycle, 167 MHz		200	mA
ISB4	Automatic CE	Max. VDD, Device Deselected,	All speed grades		135	mA
	Power Down	VIN ≥ VIH or VIN ≤ VIL, f = 0
	Current—TTL Inputs

Capacitance

Tested initially and after any design or process changes that may affect these parameters.

Parameter	Description	Test Conditions	100 TQFP	165 FBGA	209 FBGA	Unit
			Max	Max	Max
CADDRESS	Address Input Capacitance	TA = 25°C, f = 1 MHz,	6	6	6	pF
		VDD = 2.5V
CDATA	Data Input Capacitance		5	5	5	pF
		VDDQ = 2.5V
CCTRL	Control Input Capacitance		8	8	8	pF
CCLK	Clock Input Capacitance		6	6	6	pF
CIO	Input/Output Capacitance		5	5	5	pF

Thermal Resistance

Tested initially and after any design or process changes that may affect these parameters.

Parameter	Description	Test Conditions	100 TQFP	165 FBGA	209 FBGA	Unit
			Package	Package	Package
ΘJA	Thermal Resistance	Test conditions follow standard test	24.63	16.3	15.2	°C/W
	(Junction to Ambient)	methods and procedures for
		measuring thermal impedance, per
ΘJC	Thermal Resistance		2.28	2.1	1.7	°C/W
		EIA/JESD51.
	(Junction to Case)

AC Test Loads and Waveforms

2.5V IO Test Load

OUTPUT				2.5V		R = 1667Ω			ALL INPUT PULSES
								VDDQ
	Z0	= 50Ω		OUTPUT
				RL = 50Ω				10%		90%
					5 pF		R = 1538Ω	GND
								≤ 1 ns
			VL = 1.25V

90%

10%

≤ 1 ns

	INCLUDING		(c)
(a)	JIG AND	(b)
	SCOPE

Document #: 001-15032 Rev. *D Page 20 of 29

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