Cypress CY7C64215 manual Packaging Information, Package Diagrams

CY7C64215

Packaging Information

This section illustrates the package specification for the CY7C64215 enCoRe III, along with the thermal impedance for the package.

Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at http://www.cypress.com/design/MR10161.

Package Diagrams

Figure 9. 56-Pin (8x8 mm) QFN

001-12921**

Document 38-08036 Rev. *C Page 27 of 30

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