CY7C64215
Figure 10. 28-Pin Shrunk Small Outline Package
Thermal Impedance
Table 27. Thermal Impedance for the Package
Package | Typical θJA * |
56 Pin MLF | 20 oC/W |
28 Pin SSOP | 96 oC/W |
* TJ = TA + POWER x θJA |
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Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 28. Solder Reflow Peak Temperature
Package | Minimum Peak Temperature* | Maximum Peak Temperature |
56 Pin MLF | 240°C | 260°C |
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28 Pin SSOP | 240°C | 260°C |
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*Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220±5°C with
Document | Page 28 of 30 |
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