CY7C64215

Figure 10. 28-Pin Shrunk Small Outline Package

51-85079-*C

Thermal Impedance

Table 27. Thermal Impedance for the Package

Package

Typical θJA *

56 Pin MLF

20 oC/W

28 Pin SSOP

96 oC/W

* TJ = TA + POWER x θJA

 

Solder Reflow Peak Temperature

Following is the minimum solder reflow peak temperature to achieve good solderability.

Table 28. Solder Reflow Peak Temperature

Package

Minimum Peak Temperature*

Maximum Peak Temperature

56 Pin MLF

240°C

260°C

 

 

 

28 Pin SSOP

240°C

260°C

 

 

 

*Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220±5°C with Sn-Pb or 245±5°C with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.

Document 38-08036 Rev. *C

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Image 28
Cypress CY7C64215 manual Solder Reflow Peak Temperature, Thermal Impedance for the Package Typical θ JA