CY7C64215
Document 38-08036 Rev. *C Page 28 of 30
Figure 10. 28-Pin Shrunk Small Outline Package
Thermal ImpedanceSolder Reflow Peak TemperatureFollowing is the minimum solder reflow peak temperature to achieve good solderability.
Table 27. Thermal Impedance for the Package
Package Typical θ
JA
*
56 Pin MLF 20
o
C/W
28 Pin SSOP 96
o
C/W
* T
J
= T
A
+ POWER x θ
JA
51-85079-*C
Table 28. Solder Reflow Peak Temperature
Package Minimum Peak Temperature* Maximum Peak Temperature
56 Pin MLF 240°C 260°C
28 Pin SSOP 240°C 260°C
*Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220±5°C with
Sn-Pb or 245±5°C with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.
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