CY7C64215

Package Handling

Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving the factory. A label on the packaging has details about actual bake temperature and the minimum bake time to remove this moisture. The maximum bake time is the aggregate time that the parts are exposed to the bake temperature. Exceeding this exposure time may degrade device reliability.

Parameter

 

Description

 

 

Min

 

Typical

Max

Unit

TBAKETEMP

Bake Temperature

 

 

 

 

 

125

 

See package label

°C

TBAKETIME

Bake Time

 

See package label

 

 

 

72

hours

Ordering Information

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Package

 

Ordering Code

 

 

Flash Size

 

 

SRAM (Bytes)

 

 

56-Pin MLF

 

CY7C64215-56LFXC

 

 

16K

 

 

1K

 

 

 

 

 

 

 

 

 

 

 

 

 

28-Pin SSOP

 

CY7C64215-28PVXC

 

 

16K

 

 

1K

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Document 38-08036 Rev. *C

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Cypress CY7C64215 manual Package Handling, Ordering Information, Parameter Description Min Typical Max Unit