Intel 5000 manual Packaging Technology, MCH Package Dimensions Top View

Packaging Technology

2Packaging Technology

Intel 5000 Series chipset consist of three individual components: the Memory Controller Hub (MCH), the Intel® 6700PXH 64-bit PCI Hub (PXH) and the Intel® 631xESB/632xESB I/O Controller Hub. Intel 5000 Series chipset MCH components use a 42.5 mm, 10-layer flip chip ball grid array (FC-BGA) package (see Figure 2-1, , and Figure 2-2).For information on the PXH package, refer to the Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines. For information on the Intel® 631xESB/632xESB I/O Controller Hub package, refer to the Intel® 631xESB/632xESB I/O Controller Hub Thermal/Mechanical Design Guidelines.

Figure 2-1. MCH Package Dimensions (Top View)

Handling

Exclusion

Area

38.5 mm,

38.5 mm.

MCH

IHS

42.5 mm.

42.5 mm.

Figure 2-2. MCH Package Dimensions (Side View)

4.23 ± 0.146 mm
	3.79 ± 0.144 mm		IHS	Substrate
		2.44 ± 0.071 mm				See note 4.
					0.20

0.20 –C–

0.435 ± 0.025 mm	Seating Plane
	See note 1.
See note 3

Notes:

1.Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)

2.All dimensions and tolerances conform to ANSI Y14.5M-1994

3.BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm

4.Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped) orientation after reflow

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 11