Intel 5000 manual Mechanical Design Envelope, Board-Level Components Keepout Dimensions

Reference Thermal Solution

6.3Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on the Intel 5000 Series chipset MCH thermal solution are shown in .

When using heatsinks that extend beyond the chipset MCH reference heatsink envelope shown in Figure 6-2, any motherboard components placed between the heatsink and motherboard cannot exceed 2mm (0.07 in.) in height.

Figure 6-2. Tall Torsional Clip Heatsink Volumetric Envelope for the Chipset MCH

MCH		mm.
Passive
Heatsink	4.30 mm.	33.30
IHS + TIM2
FCBGA + Solder Balls
Motherboard
42.30 mm.
TNB
Heatsink
MCH	mm.
Passive
	42.30
Heatsink

6.4Board-Level Components Keepout Dimensions

The location of hole patterns and keepout zones for the reference thermal solution are shown in Figure 6-3and Figure 6-4. This reference thermal solution has the same hole patterns as that of the Intel® E7500/E7501/E7505 chipset.

28 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide