Thermal Specifications
Table 3-3. Intel® 5000X Chipset MCH Thermal Specifications
Parameter | Value | Notes |
|
|
|
Tcase_max | 105°C |
|
Tcase_min | 5°C |
|
TDPwith 1 active memory channel | 27.3 W |
|
TDPwith 2 active memory channel | 29.0 W |
|
TDPwith 4 active memory channel | 32.4 W |
|
Note: These specifications are based on preliminary silicon characterization, however, they may be updated as further data becomes available.
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14 | Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide |
