Intel 5000 manual Contents

Contents

1	Introduction		..............................................................................................................	7
	1.1	Design Flow		7
	1.2	Definition of Terms		8
	1.3	Reference Documents		9
2	Packaging Technology			11
	2.1	Package Mechanical Requirements		12
3	Thermal Specifications			13
	3.1	Thermal Design Power (TDP)		13
	3.2	Case Temperature		13
4	Thermal Simulation			15
5	Thermal Metrology			17
	5.1	MCH Case Temperature Measurement		17
		5.1.1	Supporting Test Equipment	17
		5.1.2 Thermal Calibration and Controls		18
		5.1.3	IHS Groove	18
		5.1.4 Thermocouple Conditioning and Preparation		19
		5.1.5 Thermocouple Attachment to the IHS		20
		5.1.6	Curing Process	23
		5.1.7	Thermocouple Wire Management	24
		5.1.8	Power Simulation Software	25
6	Reference Thermal Solution			27
	6.1	Operating Environment		27
	6.2	Heatsink Performance		27
	6.3	Mechanical Design Envelope		28
	6.4	Board-Level Components Keepout Dimensions		28
	6.5	Tall Torsional Clip Heatsink Thermal Solution Assembly		29
		6.5.1	Heatsink Orientation	30
		6.5.2	Extruded Heatsink Profiles	31
		6.5.3	Mechanical Interface Material	31
		6.5.4	Thermal Interface Material	31
		6.5.5	Heatsink Clip	31
		6.5.6	Clip Retention Anchors	32
	6.6	Reliability Guidelines		32
7	Reference Thermal Solution 2			35
	7.1	Operating Environment		35
	7.2	Heatsink Performance		35
	7.3	Mechanical Design Envelope		36
	7.4	Board-Level Components Keepout Dimensions		36
	7.5	Short Torsional Clip Heatsink Thermal Solution Assembly		37
		7.5.1	Heatsink Orientation	38
		7.5.2	Extruded Heatsink Profiles	39
		7.5.3	Mechanical Interface Material	39
		7.5.4	Thermal Interface Material	39
		7.5.5	Clip Retention Anchors	39
	7.6	Reliability Guidelines		39

Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide 3