Intel 5000 manual Thermal Metrology, MCH Case Temperature Measurement, Supporting Test Equipment

Thermal Metrology

5Thermal Metrology

The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the MCH case temperatures. Section 5.1 provides guidelines on how to accurately measure the MCH case temperatures. Section 5.1.8 contains information on running an application program that will emulate anticipated maximum thermal design power (Figure 5-1).

5.1MCH Case Temperature Measurement

Intel 5000 Series chipset MCH cooling performance is determined by measuring the case temperature using a thermocouple. For case temperature measurements, the attached method outlined in this section is recommended for mounting a thermocouple.

Special care is required when measuring case temperature (TC) to ensure an accurate temperature measurement. Thermocouples are often used to measure TC. When measuring the temperature of a surface that is at a different temperature from the surrounding local ambient air, errors may be introduced in the measurements. The measurement errors can be caused by poor thermal contact between the thermocouple junction and the surface of the integrated heat spreader, heat loss by radiation, convection, by conduction through thermocouple leads, or by contact between the thermocouple cement and the heatsink base. To minimize these measurement errors, the approach outlined in the next section is recommended.

5.1.1Supporting Test Equipment

To apply the reference thermocouple attach procedure, it is recommended that you use the equipment (or equivalent) given in. Table 5-1.

Table 5-1. Thermocouple Attach Support Equipment (Sheet 1 of 2)

Item	Description	Part Number
	Measurement and Output
Microscope	Olympus Light microscope or equivalent	SZ-40
Digital Multi-meter	Digital Multi Meter for resistance measurement	Not Available
	Test Fixture(s)
Micromanipulator*	Micromanipulator set from YOU Ltd. or equivalent Mechanical	YOU-3
(See note)	3D arm with needle (not included) to maintain TC bead location
	during the attach process.
	Miscellaneous Hardware
Super Bonder* 498	Super glue w/thermal characteristics	49850
Thermal Cycling
Resistant Instant
Adhesive
Adhesive Accelerator	Loctite 7452* for fast glue curing	18490
Kapton Tape	For holding thermocouple in place or equivalent	Not Available
Thermocouple	Omega, 36 gauge, “T” Type	5SRTC-TT-36-72

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 17