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Reference Thermal Solution
6.5Tall Torsional Clip Heatsink Thermal Solution Assembly
The reference thermal solution for the chipset MCH is a passive extruded heatsink with thermal interface. It is attached using a clip with each end hooked through an anchor soldered to the board. Figure
Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in Appendix B, “Mechanical Drawings.” Appendix A, “Thermal Solution Component Suppliers” contains vendor information for each thermal solution component.
Figure 6-3. Tall Torsional Clip Heatsink Board Component Keepout
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| Parallel Mean |
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| Air Flow |
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| Direction |
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| 2x | 0.475in. |
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2x | 1.109in. |
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| 2x | 1.591in. |
| 2x | 0.225in. |
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| 2x | 1.156in. |
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2.218in. |
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| MCH | 2x | 0.430in. |
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| 2x | 1.199in. |
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| 2.398in. |
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| 0.07" Max Component Height |
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| No Motherboard Component Placement Allowed |
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Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide | 29 |