Tall Torsional Clip Heatsink Thermal Solution Assembly | Intel 5000

Reference Thermal Solution

6.5Tall Torsional Clip Heatsink Thermal Solution Assembly

The reference thermal solution for the chipset MCH is a passive extruded heatsink with thermal interface. It is attached using a clip with each end hooked through an anchor soldered to the board. Figure 6-5shows the reference thermal solution assembly and associated components. The torsional clip and the clip retention anchor are the same as the one used on the Intel® E7500/E7501/E7505 chipset reference thermal solution.

Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in Appendix B, “Mechanical Drawings.” Appendix A, “Thermal Solution Component Suppliers” contains vendor information for each thermal solution component.

Figure 6-3. Tall Torsional Clip Heatsink Board Component Keepout

			Parallel Mean
			Air Flow
			Direction
	2x	0.475in.
2x	1.109in.					2x	1.591in.
	2x	0.225in.			2x	1.156in.
2.218in.			MCH	2x	0.430in.
		2x	1.199in.
			2.398in.
			0.07" Max Component Height
		No Motherboard Component Placement Allowed

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide

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Intel 5000 Tall Torsional Clip Heatsink Thermal Solution Assembly, Tall Torsional Clip Heatsink Board Component Keepout

Contents

Thermal/Mechanical Design Guide Intel 5000 Series Chipset Memory Controller HubMCHPage Contents Figures Tables Revision Description Date Number Revision Table Design Flow Introduction Thermal Design Process Definition of Terms TDP Reference Documents Introduction Packaging Technology MCH Package Dimensions Top View Package Mechanical Requirements MCH Package Dimensions Bottom View Thermal Design Power TDP Thermal SpecificationsCase Temperature Intel 5000P Chipset MCH Thermal Specifications Intel 5000X Chipset MCH Thermal Specifications Thermal Simulation Thermal Simulation Thermal Metrology MCH Case Temperature MeasurementSupporting Test Equipment Thermocouple Attach Support Equipment Sheet 1 IHS Groove Thermal Calibration and ControlsThermocouple Attach Support Equipment Sheet 2 Description Part Number Calibration and Control Thermocouple Conditioning and Preparation IHS Groove Dimensions Bending the Tip of the Thermocouple Thermocouple Attachment to the IHS Thermocouple Bead Placement Position Bead on the Groove Step Applying the Adhesive on the Thermocouple Bead Curing Process 11. Removing Excess Adhesive from the IHS 10. Thermocouple Wire Management Groove Power Simulation Software Thermal Metrology Heatsink Performance Reference Thermal SolutionOperating Environment Mechanical Design Envelope Board-Level Components Keepout Dimensions Tall Torsional Clip Heatsink Board Component Keepout Tall Torsional Clip Heatsink Thermal Solution Assembly Retention Mechanism Component Keepout Zones Heatsink Orientation Mechanical Interface Material Extruded Heatsink ProfilesThermal Interface Material Heatsink Clip Clip Retention Anchors Reliability GuidelinesReliability Guidelines Sheet 1 Test Requirement Pass/Fail Criteria Reliability Guidelines Sheet 2 Reference Thermal Solution Reference Thermal Solution Motherboard Short Torsional Clip Heatsink Board Component Keepout Short Torsional Clip Heatsink Thermal Solution Assembly Short Torsional Clip Heatsink Assembly Heatsink Clip Reference Thermal Solution Part Intel Part Number Supplier Contact Information Tall Torsional Clip Heatsink Thermal Solution Short Torsional Clip Heatsink Thermal Solution Drawing Name Table B-1. Mechanical Drawing List Figure B-1. Tall Torsional Clip Heatsink Assembly Drawing Figure B-2. Tall Torsional Clip Heatsink Drawing Sheet 1 Figure B-3. Tall Torsional Clip Heatsink Drawing Sheet 2 Figure B-4. Tall Torsional Clip Heatsink Clip Drawing Figure B-5. Short Torsional Clip Heatsink Assembly Drawing Figure B-6. Short Torsional Clip Heatsink DrawingSheet 1 Figure B-7. Short Torsional Clip Heatsink DrawingSheet 2 Figure B-8. Short Torsional Clip Heatsink Clip Drawing Mechanical Drawings