Thermal Metrology
Note: Prior to installing the heatsink, be sure that the thermocouple wires remain below the IHS top surface by running a flat blade on top of the IHS for example.
5.1.8Power Simulation Software
The power simulation software is a utility designed to dissipate the thermal design power on a Intel 5000 Series chipset MCH when used in conjunction with the Dual-Core Intel® Xeon® Processor 5000 Series Processor (1333 MHz). The combination of the above mentioned processor(s) and the higher bandwidth capability of the Intel 5000 Series chipset enable higher levels of system performance. To assess the thermal performance of the chipset MCH thermal solution under “worst-case realistic application” conditions, Intel is developing a software utility that operates the chipset at near worst-case thermal power dissipation.
The power simulation software being developed should only be used to test thermal solutions at or near the thermal design power. Figure 5-1shows a decision flowchart for determining thermal solution needs. Real world applications may exceed the thermal design power limit for transient time periods. For power supply current requirements under these transient conditions, please refer to each component’s datasheet for the ICC (Max Power Supply Current) specification. Contact your Intel field sales representative to order the thermal models and user’s guides.
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