Intel 5000 manual Definition of Terms, Thermal Design Process

Introduction

Figure 1-1. Thermal Design Process

1.2Definition of Terms

BGA	Ball grid array. A package type, defined by a resin-fiber
	substrate, onto which a die is mounted, bonded and
	encapsulated in molding compound. The primary electrical
	interface is an array of solder balls attached to the substrate
	opposite the die and
	molding compound.
BLT	Bond line thickness. Final settled thickness of the thermal
	interface material after installation of heatsink.

Intel® 631xESB/632xESB I/O Controller Hub

	The chipset component that integrates an Ultra ATA 100
	controller, six Serial ATA host controller ports, one EHCI host
	controller, and four UHCI host controllers supporting eight
	external USB 2.0 ports, LPC interface controller, flash BIOS
	interface controller, PCI interface controller, Azalia / AC’97
	digital controller, integrated LAN controller, an ASF controller
	and a ESI for communication with the MCH. The Intel 631xESB/
	632xESB I/O Controller Hub component provides the data
	buffering and interface arbitration required to ensure that
	system interfaces operate efficiently and provide the bandwidth
	necessary to enable the system to obtain peak performance.
MCH	Memory controller hub. The chipset component that contains
	the processor interface, the memory interface, the PCI Express*
	interface and the ESI interface.
PXH	Intel® 6700PXH 64-bit PCI Hub. The chipset component that
	performs PCI bridging functions between the PCI Express
	interface and the PCI Bus. It contains two PCI bus interfaces
	that can be independently configured to operate in PCI (33 or 66
	MHz) or PCI-X* mode 1 (66, 100 or 133 MHz), for either 32 or
	64 bit PCI devices.
PXH-V	Intel® 6702PXH 64-bit PCI Hub. The chipset component that
	performs PCI bridging functions between the PCI Express
	interface and the PCI Bus. It contains one PCI bus interface that
	can be configured to operate in PCI (33 or 66MHz) or PCI-X
	mode 1 (66, 100 or 133 MHz).
Tcase_max	Maximum IHS temperature allowed. This temperature is
	measured at the geometric center of the top of IHS.
8	Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide