Intel 5000 manual Heatsink Clip

Reference Thermal Solution 2

7.5.2Extruded Heatsink Profiles

The reference thermal solution uses an extruded heatsink for cooling the chipset MCH. Figure 7-6shows the heatsink profile. Appendix A, “Thermal Solution Component Suppliers” lists a supplier for this extruded heatsink. Other heatsinks with similar dimensions and increased thermal performance may be available. Full mechanical drawing of this heatsink is provided in Appendix B, “Mechanical Drawings.”

7.5.3Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.

7.5.4Thermal Interface Material

Please refer to Section 6.5.4 for details.

7.5.4.1Effect of Pressure on TIM Performance

Please refer to Section 7.5.4.1 for details.

7.5.4.2Heatsink Clip

Please refer to Section 7.5.4.2 for details.

Figure 7-6. Torsional Clip Heatsink Extrusion Profile

7.5.5Clip Retention Anchors

Please refer to Section 6.5.6 for details.

7.6Reliability Guidelines

Please refer to Section 7.6 for details.

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Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 39