Intel 80L186EA Package Thermal Specifications, 400 600 800 1000 CA Plcc, CA QFP 60.5 CA Sqfp

Models: 80L186EA 80L188EA 80C186EA 80C188EA

1 50
Download 50 pages 36.73 Kb
Page 20
Image 20

80C186EA/80C188EA, 80L186EA/80L188EA

272432 – 7

Figure 7. Shrink Quad Flat Pack (SQFP) Pinout Diagram

NOTES:

1.XXXXXXXXD indicates the Intel FPO number.

2.Pin names in parentheses apply to the 80C188EA.

PACKAGE THERMAL

SPECIFICATIONS

The 80C186EA/80L186EA is specified for operation when TC (the case temperature) is within the range of 0§C to 85§C (PLCC package) or 0§C to 106§C (QFP-EIAJ) package. TC may be measured in any environment to determine whether the processor is within the specified operating range. The case tem- perature must be measured at the center of the top surface.

TA (the ambient temperature) can be calculated from iCA (thermal resistance from the case to ambi- ent) with the following equation:

TA e TC - P c iCA

Typical values for iCA at various airflows are given in Table 10.

P (the maximum power consumption, specified in watts) is calculated by using the maximum ICC as tabulated in the DC specifications and VCC of 5.5V.

Table 10. Thermal Resistance (iCA) at Various Airflows (in §C/Watt)

 

 

Airflow Linear ft/min (m/sec)

 

 

 

 

 

 

 

 

0

200

400

600

800

1000

 

(0)

(1.01)

(2.03)

(3.04)

(4.06)

(5.07)

 

 

 

 

 

 

 

iCA (PLCC)

29

25

21

19

17

16.5

iCA (QFP)

66

63

60.5

59

58

57

iCA (SQFP)

70

 

 

 

 

 

20

20

Page 20
Image 20
Intel 80L186EA, 80L188EA, 80C188EA, 80C186EA Package Thermal Specifications, 400 600 800 1000 CA Plcc, CA QFP 60.5 CA Sqfp