80C186EA/80C188EA, 80L186EA/80L188EA
272432–7
Figure7. Shrink Quad Flat Pack (SQFP) Pinout Diagram
NOTES:
1. XXXXXXXXD indicates the Intel FPO number.
2. Pin names in parentheses apply to the 80C188EA.
PACKAGE THERMALSPECIFICATIONS
The 80C186EA/80L186EA is specified for operation
when TC(the case temperature) is within the range
of 0§Cto85
§
C (PLCC package) or 0§Cto106
§
C
(QFP-EIAJ) package. TCmay be measured in any
environment to determine whether the processor is
within the specified operating range. The case tem-
perature must be measured at the center of the top
surface.
TA(the ambient temperature) can be calculated
from iCA (thermal resistance from the case to ambi-
ent) with the following equation:
TAeTC-Pci
CA
Typical values for iCA at various airflows are given
in Table 10.
P (the maximum power consumption, specified in
watts) is calculated by using the maximum ICC as
tabulated in the DC specifications and VCC of 5.5V.
Table10. Thermal Resistance ( iCA) at Various Airflows (in §C/Watt)
AirflowLinear ft/min (m/sec)
0 200 400 600 800 1000
(0) (1.01) (2.03) (3.04) (4.06) (5.07)
iCA(PLCC) 29 25 21 19 17 16.5
iCA(QFP) 66 63 60.5 59 58 57
iCA(SQFP) 70
20
20