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80C186EA/80C188EA, 80L186EA/80L188EA
272432 – 7
Figure 7. Shrink Quad Flat Pack (SQFP) Pinout Diagram
NOTES:
1.XXXXXXXXD indicates the Intel FPO number.
2.Pin names in parentheses apply to the 80C188EA.
PACKAGE THERMAL
SPECIFICATIONS
The 80C186EA/80L186EA is specified for operation when TC (the case temperature) is within the range of 0§C to 85§C (PLCC package) or 0§C to 106§C
TA (the ambient temperature) can be calculated from iCA (thermal resistance from the case to ambi- ent) with the following equation:
TA e TC - P c iCA
Typical values for iCA at various airflows are given in Table 10.
P (the maximum power consumption, specified in watts) is calculated by using the maximum ICC as tabulated in the DC specifications and VCC of 5.5V.
Table 10. Thermal Resistance (iCA) at Various Airflows (in §C/Watt)
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| Airflow Linear ft/min (m/sec) | ||||
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| 0 | 200 | 400 | 600 | 800 | 1000 |
| (0) | (1.01) | (2.03) | (3.04) | (4.06) | (5.07) |
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iCA (PLCC) | 29 | 25 | 21 | 19 | 17 | 16.5 |
iCA (QFP) | 66 | 63 | 60.5 | 59 | 58 | 57 |
iCA (SQFP) | 70 |
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20
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