Revision HistoryIntel® Compute Module MFS2600KI TPS

 

 

 

Revision History

 

 

 

 

 

 

Date

Revision

Modifications

 

 

 

Number

 

 

 

April, 2012

0.5

Initial release.

 

 

 

 

 

 

 

June, 2012

1.0

Corrected BMC LAN settings.

 

 

 

 

 

 

Disclaimers

Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel®’s Terms and Conditions of Sale for such products, Intel® assumes no liability whatsoever, and Intel® disclaims any express or implied warranty, relating to sale and/or use of Intel® products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel® products are not intended for use in medical, lifesaving, or life sustaining applications. Intel® may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or

“undefined”. Intel® reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel® Compute Module MFS2600KI may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Intel Corporation server baseboards support peripheral components and contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel®’s own chassis are designed and tested to meet the intended thermal requirements of these components when the fully integrated system is used together. It is the responsibility of the system integrator that chooses not to use Intel® developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of air flow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if components fail or the compute module does not operate correctly when used outside any of their published operating or non-operating limits.

Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation.

*Other brands and names may be claimed as the property of others.

Copyright © Intel Corporation 2012.

ii

Revision 1.0

 

Intel order number: G51989-002