Functional Architecture | Intel® Compute Module MFS2600KI TPS |
Ranks |
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| Speed (MT/s) and Voltage Validated by |
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Per |
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| Slot per Channel (SPC) and DIMM Per Channel (DPC)2 |
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DIMM |
| Memory Capacity Per |
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and |
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| DIMM1 |
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| 1 Slot per Channel |
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| 2 Slots per Channel |
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Data |
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| 1DPC |
| 1DPC |
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Width |
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| 1.35V |
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| 1.5V |
| 1.35V |
| 1.5V |
| 1.35V |
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| 1.5V | ||||
SRx8 |
| 1GB |
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| 2GB |
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| 4GB |
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| 1066, |
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| 1066, |
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| 1066, 1333 |
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| 1066, 1333 |
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| 1066 |
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| 1066, 1333 |
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| 1333 |
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| 1333, 1600 |
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DRx8 |
| 2GB |
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| 4GB |
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| 8GB |
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| 1066, |
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| 1066, |
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| 1066, 1333 |
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| 1066, 1333 |
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| 1066 |
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| 1066, 1333 |
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| 1333 |
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| 1333, 1600 |
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SRx4 |
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| 1066, |
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| 1066, |
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| 2GB |
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| 4GB |
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| 8GB |
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| 1066, 1333 |
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| 1066, 1333 |
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| 1066 |
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| 1066, 1333 |
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| 1333 |
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DRx4 |
| 4GB |
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| 8GB |
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| 16GB |
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| 1066, |
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| 1066, 1333 |
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| 1066, 1333 |
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| 1066 |
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| 1066, 1333 |
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| 1333 |
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QRx4 |
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| 8GB |
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| 16GB |
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| 32GB |
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| 800 |
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| 1066 |
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| 800 |
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| 1066 |
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| 800 |
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| 800 |
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QRx8 |
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| 4GB |
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| 8GB |
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| 16GB |
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| 800 |
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| 1066 |
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| 800 |
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| 1066 |
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| 800 |
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| 800 |
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Notes: |
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1.Supported DRAM Densities are 1Gb, 2Gb, and 4Gb. Only 2Gb and 4Gb are validated by Intel®.
2.Command Address Timing is 1N
Supported and Validated
Supported but not Validate
TBD
Table 6. LRDIMM Support Guidelines (Preliminary. Subject to Change)Ranks |
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| Speed (MT/s) and Voltage Validated by | |||||||
Per |
| Memory Capacity Per |
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| Slot per Channel (SPC) and DIMM Per Channel (DPC)3,4,5 | ||||||||||||
DIMM |
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| 1 Slot per Channel |
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| 2 Slots per Channel | ||||||||||||
| DIMM2 |
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and Data |
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| 1DPC |
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| 1DPC and 2DPC | ||||||||||
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Width1 |
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| 1.35V |
| 1.5V |
| 1.35V |
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QRx4 |
| 16GB |
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| 32GB |
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| 1066, 1333 |
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| 1066, 1333 |
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| 1066 |
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| 1066, 1333 |
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(DDP)6 |
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QRx8 |
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| 8GB |
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| 16GB |
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| 1066, 1333 |
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| 1066, 1333 |
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| 1066 |
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| 1066, 1333 |
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(P)6 |
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Notes: |
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1.Physical Rank is used to calculate DIMM Capacity
2.Supported and validated DRAM Densities are 2Gb and 4Gb
3.Command address timing is 1N
4.The speeds are estimated targets and will be verified through simulation
5.For 3SPC/3DPC – Rank Multiplication (RM) >=2
6.DDP – Dual Die Package DRAM stacking. P – Planar monolithic DRAM Dies.
14 | Revision 1.0 |
| Intel order number: |