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Intel MFS2600KIB 3.5Intel® C602-JChipset Overvew, 3.4.4.4Mirrored Channel Mode, 3.4.4.5Lockstep Channel Mode

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Functional Architecture

Intel® Compute Module MFS2600KI TPS

3.4.4.4Mirrored Channel Mode

In Mirrored Channel Mode, the memory contents are mirrored between Channel 0 and Channel 2 and also between Channel 1 and Channel 3. As a result of the mirroring, the total physical memory available to the system is half of what is populated. Mirrored Channel Mode requires that Channel 0 and Channel 2, and Channel 1 and Channel 3 must be populated identically with regards to size and organization. DIMM slot populations within a channel do not have to be identical but the same DIMM slot location across Channel 0 and Channel 2 and across Channel 1 and Channel 3 must be populated the same.

3.4.4.5Lockstep Channel Mode

In Lockstep Channel Mode, each memory access is a 128-bit data access that spans Channel 0 and Channel 1, and Channel 2 and Channel 3. Lockstep Channel mode is the only RAS mode that allows SDDC for x8 devices. Lockstep Channel Mode requires that Channel 0 and Channel 1, and Channel 2 and Channel 3 must be populated identically with regards to size and organization. DIMM slot populations within a channel do not have to be identical but the same DIMM slot location across Channel 0 and Channel 1 and across Channel 2 and Channel 3 must be populated the same.

3.5Intel® C602-J Chipset Overvew

The Intel® C602-J chipset in the Intel® Compute Module MFS2600KI provide a connection point between various I/O components and Intel® Xeon E5-2600 processors, which includes the following core platform functions:

Digital Media Interface (DMI)

PCI Express* Interface

Serial ATA (SATA) Controller

Serial Attached SCSI (SAS)/SATA Controller

AHCI

Rapid Storage Technology

PCI Interface

Low Pin Count (LPC) Interface

Serial Peripheral Interface (SPI)

Compatibility Modules (DMA Controller, Timer/Counters, Interrupt Controller)

Advanced Programmable Interrupt Controller (APIC)

Universal Serial Bus (USB) Controllers

Gigabit Ethernet Controller

RTC

GPIO

Enhanced Power Management

Intel® Active Management Technology (Intel® AMT)

Manageability

System Management Bus (SMBus* 2.0)

Integrated NVSRAM controller

Virtualization Technology for Directed I/O (Intel® VT-d)

20	Revision 1.0
	Intel order number: G51989-002

Contents

Revision June Enterprise Platforms and Services Division Revision History Disclaimers Table of Contents Introduction Product Overview Functional Architecture Page List of Figures List of Tables < This page intentionally left blank 1.Introduction 1.1Chapter Outline 2.Product Overview 2.1Intel® Compute Module MFS2600KI Feature Set 2.2Compute Module Layout 2.2.1Connector and Component Locations 2.2.3External I/O Connector Locations 3.Functional Architecture 3.1Intel® Xeon® processor 3.1.1Processor Support 3.1.1.1Processor Socket Assembly 3.1.1.2Processor Population Rules Note: 3.1.2Processor Initialization Error Summary Table 2. Mixed Processor Configurations 3.2Processor Functions Overview 3.2.1Intel® QuickPath Interconnect 3.2.2Intel® Hyper-ThreadingTechnology 3.3Processor Integrated I/O Module (IIO) 3.3.1PCI Express Interfaces 3.3.2DMI2 Interface to the PCH 3.3.3Integrated IOAPIC 3.3.4Intel® QuickData Technology 3.4Memory Subsystem 3.4.1Integrated Memory Controller (IMC) and Memory Subsystem 3.4.1.1Intel® Compute Module MFS2600KI Supported Memory Table 4. UDIMM Support Guidelines (Preliminary. Subject to Change) Table 5. RDIMM Support Guidelines (Preliminary. Subject to Change) Table 6. LRDIMM Support Guidelines (Preliminary. Subject to Change) 3.4.2Publishing Compute Module Memory 3.4.3Memory Map and Population Rules Page Page 3.4.3.1Memory Subsystem Nomenclature 3.4.4Memory RAS 3.5Intel® C602-JChipset Overvew 3.5.1Digital Media Interface (DMI) 3.5.2PCI Express* Interface 3.5.3Serial ATA (SATA) Controller 3.5.4Low Pin Count (LPC) Interface 3.5.5Serial Peripheral Interface (SPI) 3.6Integrated Baseboard Management Controller Overview 3.6.1Super I/O Controller 3.6.2Graphics Controller and Video Support 3.6.3Baseboard Management Controller 3.7Network Interface Controller (NIC) 3.8Intel® Virtualization Technology for Directed I/O (Intel® VT-d) 4.System Security 4.1BIOS Password Protection 4.2Trusted Platform Module (TPM) Support 4.2.1TPM security BIOS 4.2.2Physical Presence 4.2.3TPM Security Setup Options 4.3Intel® Trusted Execution Technology 5.Connector/Header Locations and Pin-outs 5.1Board Connector Information 5.2Power Connectors 5.3I/O Connector Pin-outDefinition 5.3.1VGA Connector 5.3.2I/O Mezzanine Card Connector Table 18. 120-pinI/O Mezzanine Card Connector Pin-out Table 19. 120-pinI/O Mezzanine Card Connector Signal Definitions Page 5.3.3Midplane Signal Connector 5.3.4Serial Port Connector 5.3.5USB 2.0 Connectors 5.3.6Low Profile eUSB SSD Support 6.Jumper Block Settings 6.1CMOS Clear and Password Clear Usage Procedure 6.2Integrated BMC Force Update Procedure 6.3Integrated BMC Initialization 6.4ME Force Update Jumper 6.5BIOS Recovery Jumper 7.Product Regulatory Requirements 7.1Product Regulatory Requirements 7.2Product Regulatory Compliance and Safety Markings 7.3Product Environmental/Ecology Requirements Appendix A: Integration and Usage Tips Appendix B: POST Code Diagnostic LED Decoder Table 27. POST Progress Codes POST Memory Initialization MRC Diagnostic Codes Page Page Appendix C: POST Error Code Page Page Page Page POST Error Beep Code Appendix D: Supported Intel® Modular Server System Glossary Glossary Page Reference Documents