Motorola DSP56012 2.3 GROUND

2-6 DSP56012 User’s Manual MOTOROLA
Signal Descriptions
Ground
2.3 GROUND
Table 2-3 Grounds
Ground Name Description
GNDPPLL Ground—GNDP is ground dedicated for PLL use. The connection should be
provided with an extremely low-impedance path to ground. VCCP should be
bypassed to GNDP by a 0.1 µF capacitor located as close as possible to the chip
package.
GNDQ Internal Logic Ground—GNDQ is an isolated ground for the internal processing
logic. This connection must be tied externally to all other chip ground
connections. The user must provide adequate external decoupling capacitors.
GNDA A Ground—GNDA is an isolated ground for sections of the internal logic. This
connection must be tied externally to all other chip ground connections. The user
must provide adequate external decoupling capacitors.
GNDD D Ground—GNDD is an isolated ground for sections of the internal logic. This
connection must be tied externally to all other chip ground connections. The user
must provide adequate external decoupling capacitors.
GNDHHost Ground—GNDH is an isolated ground for the HI I/O drivers. This
connection must be tied externally to all other chip ground connections. The user
must provide adequate external decoupling capacitors.
GNDS Serial Host Ground—GNDS is an isolated ground for the SHI I/O drivers. This
connection must be tied externally to all other chip ground connections. The user
must provide adequate external decoupling capacitors.