NEC user manual F E D, HI

578
APPENDIX B DEVELOPMENT TOOLS
Figure B-3. EV-9200GC-80 Footprints (For Reference Only)
F
E
D
G
HI
JK
L
C
B
A
0.026 × 0.748=0.486
0.026 × 0.748=0.486
EV-9200GC-80-P1
ITEM MILLIMETERS INCHES
A
B
C
D
E
F
G
H
I
J
K
L
19.7
15.0
15.0
19.7
6.0±0.05
6.0±0.05
0.35±0.02
2.36±0.03
2.3
1.57±0.03
0.776
0.591
0.591
0.776
0.236
0.236
0.014
0.093
0.091
0.062
0.65±0.02 × 19=12.35±0.05
0.65±0.02 × 19=12.35±0.05
φ
φ
φ
+0.002
–0.001 +0.003 –0.002
+0.002
–0.001 +0.003 –0.002
+0.004
–0.003
+0.004
–0.003
+0.001
–0.002
φ
φ
φ
+0.001
–0.002
+0.001
–0.002
Dimensions of mount pad for EV-9200 and that for target
device (QFP) may be different in some parts. For the
recommended mount pad dimensions for QFP, refer to
“SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
MANUAL” (C10535E).
Caution
Based on EV-9200GC-80
(2) Pad drawing (in mm)