HCD-C5
SECTION 1
SERVICING NOTE
NOTES ON HANDLING THE OPTICAL
BLOCK OR BASE UNIT
The laser diode in the optical
During repair, pay attention to electrostatic
The flexible board is easily damaged and should be handled with care.
FOR CD
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens.
FOR MD
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight.
Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.
This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the bottom exterior.
This caution label is located inside the unit.
CAUTION
Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be damaged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of soldering iron around 270˚C during repairing.
•Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering or unsoldering.
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
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