Sony MZ-R37 specifications Printed Wiring Board, Semiconductor Location

MZ-R37

6-5. PRINTED WIRING BOARD

•Semiconductor Location

Ref. No.	Location
D401	E-4
D402	H-4
D403	G-3
D404	H-25
D406	C-3
D407	D-26
D408	F-26
D741	B-20
D742	C-20
D801	G-22
D901	H-17
D902	H-16
D903	H-19
D904	G-17
D905	H-19
D906	G-11
D907	H-16
IC301	D-24
IC302	C-25
IC303	F-24
IC304	A-23
IC501	E-19
IC601	E-21
IC602	F-23
IC701	C-19
IC761	C-21
IC801	C-22
IC802	D-4
IC803	E-5
IC901	G-20
IC951	B-22
IC971	H-17
IC972	H-11
J301	D-3
Q302	D-4
Q571	D-18
Q741	B-20
Q742	D-20
Q761	D-21
Q801	G-22
Q821	H-5
Q851	C-21
Q901	H-22
Q902	H-17
Q903	G-16
Q906	H-18
Q971	H-17

Note:

•Y : parts extracted from the conductor side.

•b : Pattern from the side which enables seeing. (The other layer’s patterns are not indicated.)

Caution:

Pattern face side: Parts on the pattern face side seen from the

(Side B) pattern face are indicated.

Parts face side: Parts on the parts face side seen from the

(Side A) parts face are indicated.

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