Intel 5000 manual Package Mechanical Requirements, MCH Package Dimensions Bottom View

Packaging Technology

Figure 2-3. MCH Package Dimensions (Bottom View)

		AV
		AU
		AT
		AR
		AP
		AN
		AM
		AL
		AK
		AJ
		AH
		AG
		AF
		AE
		AD
		AC
		AB
		AA
		Y
		W
		V
		U
		T
		R
		P
		N
		M
		L
20.202
		K
		J
		H
		G
		F
		E
		D
	37X 1.092
		C
		B
		A

2	4		6	8	10	12	14		16	18	20	22	24	26	28	30	32		34	36	38
1	3	5	7	9		11	13	15	17	19	21	23		25	27	29	31	33	35		37

37X

1.092

20.202

42.5	+
00..05	C	A
2

42.5 + 0.05 - A

-

A

B

Notes:

1.All dimensions are in millimeters.

2.All dimensions and tolerances conform to ANSI Y14.5M-1994.

2.1Package Mechanical Requirements

The Intel 5000 Series chipset MCH package has an integrated heat spreader (IHS) that is capable of sustaining a maximum static normal load of 15 lbf. These mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use condition.

Note:

1.The heatsink attach solutions must not include continuous stress to the chipset package with the exception of a uniform load to maintain the heatsink-to-package thermal interface.

2.These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface.

3.These specifications are based on limited testing for design characterization. Loading limits are for the package only.

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12 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide