Intel 5000 manual Introduction, Design Flow

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Introduction

1Introduction

As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks.

The goals of this document are to:

•Outline the thermal and mechanical operating limits and specifications for the Intel® 5000 Series chipset memory controller hub (MCH).

•Describe reference thermal solutions that meet the specification of the Intel 5000 Series chipset MCH.

Properly designed thermal solutions provide adequate cooling to maintain the

Intel 5000 Series chipset MCH die temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the Intel 5000 Series chipset MCH die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.

The simplest and most cost effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

This document addresses thermal design and specifications for the

Intel 5000 Series chipset MCH components only. For thermal design information on other chipset components, refer to the respective component datasheet. For the PXH, refer to the Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines. For the Intel® 631xESB/632xESB I/O Controller Hub, refer to the Intel® 631xESB/632xESB I/O Controller Hub Thermal/Mechanical Design Guidelines.

Note: Unless otherwise specified, the term “MCH” refers to the Intel 5000 Series chipset MCH.

1.1Design Flow

To develop a reliable, cost-effective thermal solution, several tools have been provided to the system designer. Figure 1-1illustrates the design process implicit to this document and the tools appropriate for each step.

Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide

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Contents Thermal/Mechanical Design Guide Intel 5000 Series Chipset Memory Controller HubMCHPage Contents Figures Tables Revision Description Date Number Revision TableDesign Flow IntroductionThermal Design Process Definition of TermsTDP Reference DocumentsIntroduction Packaging Technology MCH Package Dimensions Top ViewPackage Mechanical Requirements MCH Package Dimensions Bottom ViewIntel 5000P Chipset MCH Thermal Specifications Thermal SpecificationsThermal Design Power TDP Case TemperatureIntel 5000X Chipset MCH Thermal Specifications Thermal Simulation Thermal Simulation Thermocouple Attach Support Equipment Sheet 1 MCH Case Temperature MeasurementThermal Metrology Supporting Test EquipmentDescription Part Number Calibration and Control Thermal Calibration and ControlsIHS Groove Thermocouple Attach Support Equipment Sheet 2Thermocouple Conditioning and Preparation IHS Groove DimensionsBending the Tip of the Thermocouple Thermocouple Attachment to the IHSThermocouple Bead Placement Position Bead on the Groove Step Applying the Adhesive on the Thermocouple Bead Curing Process11. Removing Excess Adhesive from the IHS 10. Thermocouple Wire Management GroovePower Simulation Software Thermal Metrology Operating Environment Reference Thermal SolutionHeatsink Performance Mechanical Design Envelope Board-Level Components Keepout DimensionsTall Torsional Clip Heatsink Board Component Keepout Tall Torsional Clip Heatsink Thermal Solution AssemblyRetention Mechanism Component Keepout Zones Heatsink OrientationHeatsink Clip Extruded Heatsink ProfilesMechanical Interface Material Thermal Interface MaterialTest Requirement Pass/Fail Criteria Reliability GuidelinesClip Retention Anchors Reliability Guidelines Sheet 1Reliability Guidelines Sheet 2 Reference Thermal Solution Reference Thermal Solution Motherboard Short Torsional Clip Heatsink Board Component Keepout Short Torsional Clip Heatsink Thermal Solution AssemblyShort Torsional Clip Heatsink Assembly Heatsink Clip Reference Thermal Solution Part Intel Part Number Supplier Contact Information Tall Torsional Clip Heatsink Thermal SolutionShort Torsional Clip Heatsink Thermal Solution Drawing Name Table B-1. Mechanical Drawing ListFigure B-1. Tall Torsional Clip Heatsink Assembly Drawing Figure B-2. Tall Torsional Clip Heatsink Drawing Sheet 1 Figure B-3. Tall Torsional Clip Heatsink Drawing Sheet 2 Figure B-4. Tall Torsional Clip Heatsink Clip Drawing Figure B-5. Short Torsional Clip Heatsink Assembly Drawing Figure B-6. Short Torsional Clip Heatsink DrawingSheet 1 Figure B-7. Short Torsional Clip Heatsink DrawingSheet 2 Figure B-8. Short Torsional Clip Heatsink Clip Drawing Mechanical Drawings
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