Intel 5000 manual Thermocouple Conditioning and Preparation, IHS Groove Dimensions

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Thermal Metrology

Figure 5-1. IHS Groove Dimensions

Figure 5-2. Orientation of Thermocouple Groove Relative to Package Pin

5.1.4Thermocouple Conditioning and Preparation

1.Use a calibrated thermocouple as specified in Table 5-1.

2.Measure the thermocouple resistance by holding both wires on one probe and the tip of thermocouple to the other probe of the DMM (compare to thermocouple resistance specifications).

3.Straighten the wire for about 38 mm (1½ inch) from the bead to place it inside the channel.

4.Bend the tip of the thermocouple to approximately a 45 degree angle by 0.8 mm (0.030 inch) from the tip (Figure 5-3).

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide

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Contents Thermal/Mechanical Design Guide Intel 5000 Series Chipset Memory Controller HubMCHPage Contents Figures Tables Revision Description Date Number Revision TableDesign Flow IntroductionThermal Design Process Definition of TermsTDP Reference DocumentsIntroduction Packaging Technology MCH Package Dimensions Top ViewPackage Mechanical Requirements MCH Package Dimensions Bottom ViewIntel 5000P Chipset MCH Thermal Specifications Thermal SpecificationsThermal Design Power TDP Case TemperatureIntel 5000X Chipset MCH Thermal Specifications Thermal Simulation Thermal Simulation Thermocouple Attach Support Equipment Sheet 1 MCH Case Temperature MeasurementThermal Metrology Supporting Test EquipmentDescription Part Number Calibration and Control Thermal Calibration and ControlsIHS Groove Thermocouple Attach Support Equipment Sheet 2Thermocouple Conditioning and Preparation IHS Groove DimensionsBending the Tip of the Thermocouple Thermocouple Attachment to the IHSThermocouple Bead Placement Position Bead on the Groove Step Applying the Adhesive on the Thermocouple Bead Curing Process11. Removing Excess Adhesive from the IHS 10. Thermocouple Wire Management GroovePower Simulation Software Thermal Metrology Operating Environment Reference Thermal SolutionHeatsink Performance Mechanical Design Envelope Board-Level Components Keepout DimensionsTall Torsional Clip Heatsink Board Component Keepout Tall Torsional Clip Heatsink Thermal Solution AssemblyRetention Mechanism Component Keepout Zones Heatsink OrientationHeatsink Clip Extruded Heatsink ProfilesMechanical Interface Material Thermal Interface MaterialTest Requirement Pass/Fail Criteria Reliability GuidelinesClip Retention Anchors Reliability Guidelines Sheet 1Reliability Guidelines Sheet 2 Reference Thermal Solution Reference Thermal Solution Motherboard Short Torsional Clip Heatsink Board Component Keepout Short Torsional Clip Heatsink Thermal Solution AssemblyShort Torsional Clip Heatsink Assembly Heatsink Clip Reference Thermal Solution Part Intel Part Number Supplier Contact Information Tall Torsional Clip Heatsink Thermal SolutionShort Torsional Clip Heatsink Thermal Solution Drawing Name Table B-1. Mechanical Drawing ListFigure B-1. Tall Torsional Clip Heatsink Assembly Drawing Figure B-2. Tall Torsional Clip Heatsink Drawing Sheet 1 Figure B-3. Tall Torsional Clip Heatsink Drawing Sheet 2 Figure B-4. Tall Torsional Clip Heatsink Clip Drawing Figure B-5. Short Torsional Clip Heatsink Assembly Drawing Figure B-6. Short Torsional Clip Heatsink DrawingSheet 1 Figure B-7. Short Torsional Clip Heatsink DrawingSheet 2 Figure B-8. Short Torsional Clip Heatsink Clip Drawing Mechanical Drawings