Intel 5000 manual Mechanical Design Envelope, Board-Level Components Keepout Dimensions

Page 28

Reference Thermal Solution

6.3Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on the Intel 5000 Series chipset MCH thermal solution are shown in .

When using heatsinks that extend beyond the chipset MCH reference heatsink envelope shown in Figure 6-2, any motherboard components placed between the heatsink and motherboard cannot exceed 2mm (0.07 in.) in height.

Figure 6-2. Tall Torsional Clip Heatsink Volumetric Envelope for the Chipset MCH

MCH		mm.
Passive		mm.
Heatsink	4.30 mm.	33.30
	4.30 mm.	33.30
IHS + TIM2
FCBGA + Solder Balls
Motherboard
42.30 mm.
TNB
Heatsink
MCH	mm.
Passive	mm.
Passive	42.30
Heatsink	42.30

6.4Board-Level Components Keepout Dimensions

The location of hole patterns and keepout zones for the reference thermal solution are shown in Figure 6-3and Figure 6-4. This reference thermal solution has the same hole patterns as that of the Intel® E7500/E7501/E7505 chipset.

28	Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide

Image 28

Contents Intel 5000 Series Chipset Memory Controller HubMCH Thermal/Mechanical Design GuidePage Contents Figures Tables Revision Table Revision Description Date NumberIntroduction Design FlowDefinition of Terms Thermal Design ProcessReference Documents TDPIntroduction MCH Package Dimensions Top View Packaging TechnologyMCH Package Dimensions Bottom View Package Mechanical RequirementsThermal Specifications Thermal Design Power TDPCase Temperature Intel 5000P Chipset MCH Thermal SpecificationsIntel 5000X Chipset MCH Thermal Specifications Thermal Simulation Thermal Simulation MCH Case Temperature Measurement Thermal MetrologySupporting Test Equipment Thermocouple Attach Support Equipment Sheet 1Thermal Calibration and Controls IHS GrooveThermocouple Attach Support Equipment Sheet 2 Description Part Number Calibration and ControlIHS Groove Dimensions Thermocouple Conditioning and PreparationThermocouple Attachment to the IHS Bending the Tip of the ThermocoupleThermocouple Bead Placement Position Bead on the Groove Step Curing Process Applying the Adhesive on the Thermocouple Bead10. Thermocouple Wire Management Groove 11. Removing Excess Adhesive from the IHSPower Simulation Software Thermal Metrology Operating Environment Reference Thermal SolutionHeatsink Performance Board-Level Components Keepout Dimensions Mechanical Design EnvelopeTall Torsional Clip Heatsink Thermal Solution Assembly Tall Torsional Clip Heatsink Board Component KeepoutHeatsink Orientation Retention Mechanism Component Keepout ZonesExtruded Heatsink Profiles Mechanical Interface MaterialThermal Interface Material Heatsink ClipReliability Guidelines Clip Retention AnchorsReliability Guidelines Sheet 1 Test Requirement Pass/Fail CriteriaReliability Guidelines Sheet 2 Reference Thermal Solution Reference Thermal Solution Motherboard Short Torsional Clip Heatsink Thermal Solution Assembly Short Torsional Clip Heatsink Board Component KeepoutShort Torsional Clip Heatsink Assembly Heatsink Clip Reference Thermal Solution Tall Torsional Clip Heatsink Thermal Solution Part Intel Part Number Supplier Contact InformationShort Torsional Clip Heatsink Thermal Solution Table B-1. Mechanical Drawing List Drawing NameFigure B-1. Tall Torsional Clip Heatsink Assembly Drawing Figure B-2. Tall Torsional Clip Heatsink Drawing Sheet 1 Figure B-3. Tall Torsional Clip Heatsink Drawing Sheet 2 Figure B-4. Tall Torsional Clip Heatsink Clip Drawing Figure B-5. Short Torsional Clip Heatsink Assembly Drawing Figure B-6. Short Torsional Clip Heatsink DrawingSheet 1 Figure B-7. Short Torsional Clip Heatsink DrawingSheet 2 Figure B-8. Short Torsional Clip Heatsink Clip Drawing Mechanical Drawings