Intel 5000 manual Tall Torsional Clip Heatsink Thermal Solution Assembly

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Reference Thermal Solution

6.5Tall Torsional Clip Heatsink Thermal Solution Assembly

The reference thermal solution for the chipset MCH is a passive extruded heatsink with thermal interface. It is attached using a clip with each end hooked through an anchor soldered to the board. Figure 6-5shows the reference thermal solution assembly and associated components. The torsional clip and the clip retention anchor are the same as the one used on the Intel® E7500/E7501/E7505 chipset reference thermal solution.

Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in Appendix B, “Mechanical Drawings.” Appendix A, “Thermal Solution Component Suppliers” contains vendor information for each thermal solution component.

Figure 6-3. Tall Torsional Clip Heatsink Board Component Keepout

			Parallel Mean
			Air Flow
			Direction
	2x	0.475in.
2x	1.109in.					2x	1.591in.
	2x	0.225in.			2x	1.156in.
2.218in.			MCH	2x	0.430in.
		2x	1.199in.
			2.398in.
			0.07" Max Component Height
		No Motherboard Component Placement Allowed

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide

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Contents Thermal/Mechanical Design Guide Intel 5000 Series Chipset Memory Controller HubMCHPage Contents Figures Tables Revision Description Date Number Revision TableDesign Flow IntroductionThermal Design Process Definition of TermsTDP Reference DocumentsIntroduction Packaging Technology MCH Package Dimensions Top ViewPackage Mechanical Requirements MCH Package Dimensions Bottom ViewThermal Design Power TDP Thermal SpecificationsCase Temperature Intel 5000P Chipset MCH Thermal SpecificationsIntel 5000X Chipset MCH Thermal Specifications Thermal Simulation Thermal Simulation Thermal Metrology MCH Case Temperature MeasurementSupporting Test Equipment Thermocouple Attach Support Equipment Sheet 1IHS Groove Thermal Calibration and ControlsThermocouple Attach Support Equipment Sheet 2 Description Part Number Calibration and ControlThermocouple Conditioning and Preparation IHS Groove DimensionsBending the Tip of the Thermocouple Thermocouple Attachment to the IHSThermocouple Bead Placement Position Bead on the Groove Step Applying the Adhesive on the Thermocouple Bead Curing Process11. Removing Excess Adhesive from the IHS 10. Thermocouple Wire Management GroovePower Simulation Software Thermal Metrology Heatsink Performance Reference Thermal SolutionOperating Environment Mechanical Design Envelope Board-Level Components Keepout DimensionsTall Torsional Clip Heatsink Board Component Keepout Tall Torsional Clip Heatsink Thermal Solution AssemblyRetention Mechanism Component Keepout Zones Heatsink OrientationMechanical Interface Material Extruded Heatsink ProfilesThermal Interface Material Heatsink ClipClip Retention Anchors Reliability GuidelinesReliability Guidelines Sheet 1 Test Requirement Pass/Fail CriteriaReliability Guidelines Sheet 2 Reference Thermal Solution Reference Thermal Solution Motherboard Short Torsional Clip Heatsink Board Component Keepout Short Torsional Clip Heatsink Thermal Solution AssemblyShort Torsional Clip Heatsink Assembly Heatsink Clip Reference Thermal Solution Part Intel Part Number Supplier Contact Information Tall Torsional Clip Heatsink Thermal SolutionShort Torsional Clip Heatsink Thermal Solution Drawing Name Table B-1. Mechanical Drawing ListFigure B-1. Tall Torsional Clip Heatsink Assembly Drawing Figure B-2. Tall Torsional Clip Heatsink Drawing Sheet 1 Figure B-3. Tall Torsional Clip Heatsink Drawing Sheet 2 Figure B-4. Tall Torsional Clip Heatsink Clip Drawing Figure B-5. Short Torsional Clip Heatsink Assembly Drawing Figure B-6. Short Torsional Clip Heatsink DrawingSheet 1 Figure B-7. Short Torsional Clip Heatsink DrawingSheet 2 Figure B-8. Short Torsional Clip Heatsink Clip Drawing Mechanical Drawings