Reference Thermal Solution
Figure 6-6. Tall Torsional Clip Heatsink Extrusion Profile
6.5.6Clip Retention Anchors
For Intel 5000 Series
6.6Reliability Guidelines
Each motherboard, heatsink and attach combination may vary the mechanical loading of the component. Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. Some general recommendations are shown in Table
Table 6-2. Reliability Guidelines (Sheet 1 of 2)
Test (1) | Requirement | Pass/Fail Criteria (2) |
Mechanical Shock | 50 g, board level, 11 msec, 3 shocks/axis | Visual Check and Electrical |
|
| Functional Test |
|
|
|
Random Vibration | 7.3 g, board level, 45 min/axis, 50 Hz to 2000 Hz | Visual Check and Electrical |
|
| Functional Test |
|
|
|
32 | Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide |