Intel 5000 manual Reference Documents, Tdp

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Introduction

Tcase_min

TDP

Minimum IHS temperature allowed. This temperature is measured at the geometric center of the top of IHS.

Thermal design power. Thermal solutions should be designed to dissipate this target power level. TDP is not the maximum power that the chipset can dissipate.

1.3Reference Documents

The reader of this specification should also be familiar with material and concepts presented in the following documents:

•Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guide

•Intel® 6700PXH 64-bit PCI Hub Datasheet

•Intel® 631xESB/632xESB I/O Controller Hub Thermal/Mechanical Design Guidelines

•Intel® 5000P/5000V/5000Z Chipset Memory Controller Hub (MCH) Datasheet

•Intel® 5000X Chipset Memory Controller Hub (MCH) Datasheet

•Dual-Core Intel® Xeon® Processor 5000 Series Datasheet

•Dual-Core Intel® Xeon® Processor 5000 Series Thermal/Mechanical Design Guidelines

•BGA/OLGA Assembly Development Guide

•Various system thermal design suggestions (http://www.formfactors.org)

Note:	Unless otherwise specified, these documents are available through your Intel field sales
	representative. Some documents may not be available at this time.

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Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide

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Contents Thermal/Mechanical Design Guide Intel 5000 Series Chipset Memory Controller HubMCHPage Contents Figures Tables Revision Description Date Number Revision TableDesign Flow IntroductionThermal Design Process Definition of TermsTDP Reference DocumentsIntroduction Packaging Technology MCH Package Dimensions Top ViewPackage Mechanical Requirements MCH Package Dimensions Bottom ViewThermal Design Power TDP Thermal SpecificationsCase Temperature Intel 5000P Chipset MCH Thermal SpecificationsIntel 5000X Chipset MCH Thermal Specifications Thermal Simulation Thermal Simulation Thermal Metrology MCH Case Temperature MeasurementSupporting Test Equipment Thermocouple Attach Support Equipment Sheet 1IHS Groove Thermal Calibration and ControlsThermocouple Attach Support Equipment Sheet 2 Description Part Number Calibration and ControlThermocouple Conditioning and Preparation IHS Groove DimensionsBending the Tip of the Thermocouple Thermocouple Attachment to the IHSThermocouple Bead Placement Position Bead on the Groove Step Applying the Adhesive on the Thermocouple Bead Curing Process11. Removing Excess Adhesive from the IHS 10. Thermocouple Wire Management GroovePower Simulation Software Thermal Metrology Reference Thermal Solution Operating EnvironmentHeatsink Performance Mechanical Design Envelope Board-Level Components Keepout DimensionsTall Torsional Clip Heatsink Board Component Keepout Tall Torsional Clip Heatsink Thermal Solution AssemblyRetention Mechanism Component Keepout Zones Heatsink OrientationMechanical Interface Material Extruded Heatsink ProfilesThermal Interface Material Heatsink ClipClip Retention Anchors Reliability GuidelinesReliability Guidelines Sheet 1 Test Requirement Pass/Fail CriteriaReliability Guidelines Sheet 2 Reference Thermal Solution Reference Thermal Solution Motherboard Short Torsional Clip Heatsink Board Component Keepout Short Torsional Clip Heatsink Thermal Solution AssemblyShort Torsional Clip Heatsink Assembly Heatsink Clip Reference Thermal Solution Part Intel Part Number Supplier Contact Information Tall Torsional Clip Heatsink Thermal SolutionShort Torsional Clip Heatsink Thermal Solution Drawing Name Table B-1. Mechanical Drawing ListFigure B-1. Tall Torsional Clip Heatsink Assembly Drawing Figure B-2. Tall Torsional Clip Heatsink Drawing Sheet 1 Figure B-3. Tall Torsional Clip Heatsink Drawing Sheet 2 Figure B-4. Tall Torsional Clip Heatsink Clip Drawing Figure B-5. Short Torsional Clip Heatsink Assembly Drawing Figure B-6. Short Torsional Clip Heatsink DrawingSheet 1 Figure B-7. Short Torsional Clip Heatsink DrawingSheet 2 Figure B-8. Short Torsional Clip Heatsink Clip Drawing Mechanical Drawings