Intel manual Intel 5000X Chipset MCH Thermal Specifications

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Thermal Specifications

Table 3-3. Intel® 5000X Chipset MCH Thermal Specifications

Parameter	Value	Notes

Tcase_max	105°C
Tcase_min	5°C
TDPwith 1 active memory channel	27.3 W
TDPwith 2 active memory channel	29.0 W
TDPwith 4 active memory channel	32.4 W

Note: These specifications are based on preliminary silicon characterization, however, they may be updated as further data becomes available.

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14	Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide

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Contents Intel 5000 Series Chipset Memory Controller HubMCH Thermal/Mechanical Design GuidePage Contents Figures Tables Revision Table Revision Description Date NumberIntroduction Design FlowDefinition of Terms Thermal Design ProcessReference Documents TDPIntroduction MCH Package Dimensions Top View Packaging TechnologyMCH Package Dimensions Bottom View Package Mechanical RequirementsCase Temperature Thermal SpecificationsThermal Design Power TDP Intel 5000P Chipset MCH Thermal SpecificationsIntel 5000X Chipset MCH Thermal Specifications Thermal Simulation Thermal Simulation Supporting Test Equipment MCH Case Temperature MeasurementThermal Metrology Thermocouple Attach Support Equipment Sheet 1Thermocouple Attach Support Equipment Sheet 2 Thermal Calibration and ControlsIHS Groove Description Part Number Calibration and ControlIHS Groove Dimensions Thermocouple Conditioning and PreparationThermocouple Attachment to the IHS Bending the Tip of the ThermocoupleThermocouple Bead Placement Position Bead on the Groove Step Curing Process Applying the Adhesive on the Thermocouple Bead10. Thermocouple Wire Management Groove 11. Removing Excess Adhesive from the IHSPower Simulation Software Thermal Metrology Heatsink Performance Reference Thermal SolutionOperating Environment Board-Level Components Keepout Dimensions Mechanical Design EnvelopeTall Torsional Clip Heatsink Thermal Solution Assembly Tall Torsional Clip Heatsink Board Component KeepoutHeatsink Orientation Retention Mechanism Component Keepout ZonesThermal Interface Material Extruded Heatsink ProfilesMechanical Interface Material Heatsink ClipReliability Guidelines Sheet 1 Reliability GuidelinesClip Retention Anchors Test Requirement Pass/Fail CriteriaReliability Guidelines Sheet 2 Reference Thermal Solution Reference Thermal Solution Motherboard Short Torsional Clip Heatsink Thermal Solution Assembly Short Torsional Clip Heatsink Board Component KeepoutShort Torsional Clip Heatsink Assembly Heatsink Clip Reference Thermal Solution Tall Torsional Clip Heatsink Thermal Solution Part Intel Part Number Supplier Contact InformationShort Torsional Clip Heatsink Thermal Solution Table B-1. Mechanical Drawing List Drawing NameFigure B-1. Tall Torsional Clip Heatsink Assembly Drawing Figure B-2. Tall Torsional Clip Heatsink Drawing Sheet 1 Figure B-3. Tall Torsional Clip Heatsink Drawing Sheet 2 Figure B-4. Tall Torsional Clip Heatsink Clip Drawing Figure B-5. Short Torsional Clip Heatsink Assembly Drawing Figure B-6. Short Torsional Clip Heatsink DrawingSheet 1 Figure B-7. Short Torsional Clip Heatsink DrawingSheet 2 Figure B-8. Short Torsional Clip Heatsink Clip Drawing Mechanical Drawings