Intel 5000 manual Definition of Terms, Thermal Design Process

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Introduction

Figure 1-1. Thermal Design Process

1.2Definition of Terms

BGA	Ball grid array. A package type, defined by a resin-fiber
	substrate, onto which a die is mounted, bonded and
	encapsulated in molding compound. The primary electrical
	interface is an array of solder balls attached to the substrate
	opposite the die and
	molding compound.
BLT	Bond line thickness. Final settled thickness of the thermal
	interface material after installation of heatsink.

Intel® 631xESB/632xESB I/O Controller Hub

	The chipset component that integrates an Ultra ATA 100
	controller, six Serial ATA host controller ports, one EHCI host
	controller, and four UHCI host controllers supporting eight
	external USB 2.0 ports, LPC interface controller, flash BIOS
	interface controller, PCI interface controller, Azalia / AC’97
	digital controller, integrated LAN controller, an ASF controller
	and a ESI for communication with the MCH. The Intel 631xESB/
	632xESB I/O Controller Hub component provides the data
	buffering and interface arbitration required to ensure that
	system interfaces operate efficiently and provide the bandwidth
	necessary to enable the system to obtain peak performance.
MCH	Memory controller hub. The chipset component that contains
	the processor interface, the memory interface, the PCI Express*
	interface and the ESI interface.
PXH	Intel® 6700PXH 64-bit PCI Hub. The chipset component that
	performs PCI bridging functions between the PCI Express
	interface and the PCI Bus. It contains two PCI bus interfaces
	that can be independently configured to operate in PCI (33 or 66
	MHz) or PCI-X* mode 1 (66, 100 or 133 MHz), for either 32 or
	64 bit PCI devices.
PXH-V	Intel® 6702PXH 64-bit PCI Hub. The chipset component that
	performs PCI bridging functions between the PCI Express
	interface and the PCI Bus. It contains one PCI bus interface that
	can be configured to operate in PCI (33 or 66MHz) or PCI-X
	mode 1 (66, 100 or 133 MHz).
Tcase_max	Maximum IHS temperature allowed. This temperature is
	measured at the geometric center of the top of IHS.
8	Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide

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Contents Intel 5000 Series Chipset Memory Controller HubMCH Thermal/Mechanical Design GuidePage Contents Figures Tables Revision Table Revision Description Date NumberIntroduction Design FlowDefinition of Terms Thermal Design ProcessReference Documents TDPIntroduction MCH Package Dimensions Top View Packaging TechnologyMCH Package Dimensions Bottom View Package Mechanical RequirementsThermal Specifications Thermal Design Power TDPCase Temperature Intel 5000P Chipset MCH Thermal SpecificationsIntel 5000X Chipset MCH Thermal Specifications Thermal Simulation Thermal Simulation MCH Case Temperature Measurement Thermal MetrologySupporting Test Equipment Thermocouple Attach Support Equipment Sheet 1Thermal Calibration and Controls IHS GrooveThermocouple Attach Support Equipment Sheet 2 Description Part Number Calibration and ControlIHS Groove Dimensions Thermocouple Conditioning and PreparationThermocouple Attachment to the IHS Bending the Tip of the ThermocoupleThermocouple Bead Placement Position Bead on the Groove Step Curing Process Applying the Adhesive on the Thermocouple Bead10. Thermocouple Wire Management Groove 11. Removing Excess Adhesive from the IHSPower Simulation Software Thermal Metrology Heatsink Performance Reference Thermal SolutionOperating Environment Board-Level Components Keepout Dimensions Mechanical Design EnvelopeTall Torsional Clip Heatsink Thermal Solution Assembly Tall Torsional Clip Heatsink Board Component KeepoutHeatsink Orientation Retention Mechanism Component Keepout ZonesExtruded Heatsink Profiles Mechanical Interface MaterialThermal Interface Material Heatsink ClipReliability Guidelines Clip Retention AnchorsReliability Guidelines Sheet 1 Test Requirement Pass/Fail CriteriaReliability Guidelines Sheet 2 Reference Thermal Solution Reference Thermal Solution Motherboard Short Torsional Clip Heatsink Thermal Solution Assembly Short Torsional Clip Heatsink Board Component KeepoutShort Torsional Clip Heatsink Assembly Heatsink Clip Reference Thermal Solution Tall Torsional Clip Heatsink Thermal Solution Part Intel Part Number Supplier Contact InformationShort Torsional Clip Heatsink Thermal Solution Table B-1. Mechanical Drawing List Drawing NameFigure B-1. Tall Torsional Clip Heatsink Assembly Drawing Figure B-2. Tall Torsional Clip Heatsink Drawing Sheet 1 Figure B-3. Tall Torsional Clip Heatsink Drawing Sheet 2 Figure B-4. Tall Torsional Clip Heatsink Clip Drawing Figure B-5. Short Torsional Clip Heatsink Assembly Drawing Figure B-6. Short Torsional Clip Heatsink DrawingSheet 1 Figure B-7. Short Torsional Clip Heatsink DrawingSheet 2 Figure B-8. Short Torsional Clip Heatsink Clip Drawing Mechanical Drawings