Intel 5000 manual Thermocouple Attachment to the IHS, Bending the Tip of the Thermocouple

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Thermal Metrology

Figure 5-3. Bending the Tip of the Thermocouple

5.1.5Thermocouple Attachment to the IHS

Caution: To avoid the impact on the thermocouple during the SMT process, reflow must be performed before attaching the thermocouple to the grooved MCH IHS.

1.Clean the thermocouple wire groove with isopropyl alcohol (IPA) and a lint free cloth removing all residues prior to thermocouple attachment.

2.Place the thermocouple wire inside the groove letting the exposed wire and bead extend about 3.2 mm (0.125 inch) past the end of groove. Secure it with Kapton tape (Figure 5-4).

3.Lift the wire at the middle of groove with tweezers and bend the front of wire to place the thermocouple in the channel ensuring the tip is in contact with the end of the channel grooved in the IHS (Figure 5-5A and B).

4.Place the MCH under the microscope unit (similar to the one used in Figure 5-8) to continue with process. It is also recommended to use a fixture to help holding the unit in place for the rest of the attach process.

5.Press the wire down about 6 mm (0.125 in.) from the thermocouple bead using the tweezers. Look in the microscope to perform this task. Place a piece of Kapton tape to hold the wire inside the groove (Figure 5-7). Refer to Figure 5-6for detailed bead placement.

6.Using the micromanipulator, place the needle near to the end of groove on top of thermocouple. Using the X, Y, and Z axes on the arm, places the tip of needle on top of the thermocouple bead. Press down until the bead is seated at the end of groove on top of the step (see Figure 5-6and Figure 5-7).

7.Measure resistance from thermocouple end wires (hold both wires to a DMM probe) to the IHS surface. This should be the same value as measured during the thermocouple conditioning see “Thermocouple Conditioning and Preparation” on page 19, step 2 and Figure 5-8.

8.Place a small amount of Loctite 498* adhesive in the groove where the bead is installed. Using a fine point device, spread the adhesive in the groove around the needle, the thermocouple bead and the thermocouple wires already installed in the groove during step 5. Be careful not to move the thermocouple bead during this step (Figure 5-9).

20	Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide

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Contents Intel 5000 Series Chipset Memory Controller HubMCH Thermal/Mechanical Design GuidePage Contents Figures Tables Revision Table Revision Description Date NumberIntroduction Design FlowDefinition of Terms Thermal Design ProcessReference Documents TDPIntroduction MCH Package Dimensions Top View Packaging TechnologyMCH Package Dimensions Bottom View Package Mechanical RequirementsThermal Specifications Thermal Design Power TDPCase Temperature Intel 5000P Chipset MCH Thermal SpecificationsIntel 5000X Chipset MCH Thermal Specifications Thermal Simulation Thermal Simulation MCH Case Temperature Measurement Thermal MetrologySupporting Test Equipment Thermocouple Attach Support Equipment Sheet 1Thermal Calibration and Controls IHS GrooveThermocouple Attach Support Equipment Sheet 2 Description Part Number Calibration and ControlIHS Groove Dimensions Thermocouple Conditioning and PreparationThermocouple Attachment to the IHS Bending the Tip of the ThermocoupleThermocouple Bead Placement Position Bead on the Groove Step Curing Process Applying the Adhesive on the Thermocouple Bead10. Thermocouple Wire Management Groove 11. Removing Excess Adhesive from the IHSPower Simulation Software Thermal Metrology Heatsink Performance Reference Thermal SolutionOperating Environment Board-Level Components Keepout Dimensions Mechanical Design EnvelopeTall Torsional Clip Heatsink Thermal Solution Assembly Tall Torsional Clip Heatsink Board Component KeepoutHeatsink Orientation Retention Mechanism Component Keepout ZonesExtruded Heatsink Profiles Mechanical Interface MaterialThermal Interface Material Heatsink ClipReliability Guidelines Clip Retention AnchorsReliability Guidelines Sheet 1 Test Requirement Pass/Fail CriteriaReliability Guidelines Sheet 2 Reference Thermal Solution Reference Thermal Solution Motherboard Short Torsional Clip Heatsink Thermal Solution Assembly Short Torsional Clip Heatsink Board Component KeepoutShort Torsional Clip Heatsink Assembly Heatsink Clip Reference Thermal Solution Tall Torsional Clip Heatsink Thermal Solution Part Intel Part Number Supplier Contact InformationShort Torsional Clip Heatsink Thermal Solution Table B-1. Mechanical Drawing List Drawing NameFigure B-1. Tall Torsional Clip Heatsink Assembly Drawing Figure B-2. Tall Torsional Clip Heatsink Drawing Sheet 1 Figure B-3. Tall Torsional Clip Heatsink Drawing Sheet 2 Figure B-4. Tall Torsional Clip Heatsink Clip Drawing Figure B-5. Short Torsional Clip Heatsink Assembly Drawing Figure B-6. Short Torsional Clip Heatsink DrawingSheet 1 Figure B-7. Short Torsional Clip Heatsink DrawingSheet 2 Figure B-8. Short Torsional Clip Heatsink Clip Drawing Mechanical Drawings