Thermal Solution Component Suppliers
AThermal Solution Component Suppliers
A.1 Tall Torsional Clip Heatsink Thermal Solution
Part | Intel Part Number | Supplier | Contact Information | |
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Heatsink Assembly includes: | CCI/ACK* | Harry Lin (USA) | ||
Unidirectional Fin Heatsink |
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Thermal Interface Material |
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| hlinack@aol.com | |
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| Monica Chih (Taiwan) | ||
Torsional Clip |
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| monica_chih@ccic.com.tw | |
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Undirectional Fin Heatsink | CCI/ACK | Harry Lin (USA) | ||
(42.30 x 42.30 x 29.0 mm) |
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| hlinack@aol.com | |
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| Monica Chih (Taiwan) | |
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| monica_chih@ccic.com.tw | |
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Thermal Interface | Honeywell | Scott Miller | ||
(PCM45F) |
| PCM45 F* | ||
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| scott.miller4@honeywell.com | |
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Heatsink Attach Clip | CCI/ACK | Harry Lin (USA) | ||
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| hlinack@aol.com | |
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| Monica Chih (Taiwan) | |
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| monica_chih@ccic.com.tw | |
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| Foxconn | Bob Hall (USA) | |
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| bhall@foxconn.com | |
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Foxconn | Julia Jiang (USA) | |||
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| juliaj@foxconn.com | |
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Note: The enabled components may not be currently available from all suppliers. Contact the supplier directly to verify time of component availability.
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide | 41 |