Intel 5000 manual Thermal Metrology, MCH Case Temperature Measurement, Supporting Test Equipment

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Thermal Metrology

5Thermal Metrology

The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the MCH case temperatures. Section 5.1 provides guidelines on how to accurately measure the MCH case temperatures. Section 5.1.8 contains information on running an application program that will emulate anticipated maximum thermal design power (Figure 5-1).

5.1MCH Case Temperature Measurement

Intel 5000 Series chipset MCH cooling performance is determined by measuring the case temperature using a thermocouple. For case temperature measurements, the attached method outlined in this section is recommended for mounting a thermocouple.

Special care is required when measuring case temperature (TC) to ensure an accurate temperature measurement. Thermocouples are often used to measure TC. When measuring the temperature of a surface that is at a different temperature from the surrounding local ambient air, errors may be introduced in the measurements. The measurement errors can be caused by poor thermal contact between the thermocouple junction and the surface of the integrated heat spreader, heat loss by radiation, convection, by conduction through thermocouple leads, or by contact between the thermocouple cement and the heatsink base. To minimize these measurement errors, the approach outlined in the next section is recommended.

5.1.1Supporting Test Equipment

To apply the reference thermocouple attach procedure, it is recommended that you use the equipment (or equivalent) given in. Table 5-1.

Table 5-1. Thermocouple Attach Support Equipment (Sheet 1 of 2)

Item

Description

Part Number

 

 

 

 

Measurement and Output

 

 

 

 

Microscope

Olympus Light microscope or equivalent

SZ-40

 

 

 

Digital Multi-meter

Digital Multi Meter for resistance measurement

Not Available

 

Test Fixture(s)

 

 

 

 

Micromanipulator*

Micromanipulator set from YOU Ltd. or equivalent Mechanical

YOU-3

(See note)

3D arm with needle (not included) to maintain TC bead location

 

 

during the attach process.

 

 

 

 

 

Miscellaneous Hardware

 

 

 

 

Super Bonder* 498

Super glue w/thermal characteristics

49850

Thermal Cycling

 

 

Resistant Instant

 

 

Adhesive

 

 

 

 

 

Adhesive Accelerator

Loctite 7452* for fast glue curing

18490

 

 

 

Kapton Tape

For holding thermocouple in place or equivalent

Not Available

 

 

 

Thermocouple

Omega, 36 gauge, “T” Type

5SRTC-TT-36-72

 

 

 

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide

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Contents Thermal/Mechanical Design Guide Intel 5000 Series Chipset Memory Controller HubMCHPage Contents Figures Tables Revision Description Date Number Revision TableDesign Flow IntroductionThermal Design Process Definition of TermsTDP Reference DocumentsIntroduction Packaging Technology MCH Package Dimensions Top ViewPackage Mechanical Requirements MCH Package Dimensions Bottom ViewThermal Design Power TDP Thermal SpecificationsCase Temperature Intel 5000P Chipset MCH Thermal SpecificationsIntel 5000X Chipset MCH Thermal Specifications Thermal Simulation Thermal Simulation Thermal Metrology MCH Case Temperature MeasurementSupporting Test Equipment Thermocouple Attach Support Equipment Sheet 1IHS Groove Thermal Calibration and ControlsThermocouple Attach Support Equipment Sheet 2 Description Part Number Calibration and ControlThermocouple Conditioning and Preparation IHS Groove DimensionsBending the Tip of the Thermocouple Thermocouple Attachment to the IHSThermocouple Bead Placement Position Bead on the Groove Step Applying the Adhesive on the Thermocouple Bead Curing Process11. Removing Excess Adhesive from the IHS 10. Thermocouple Wire Management GroovePower Simulation Software Thermal Metrology Heatsink Performance Reference Thermal SolutionOperating Environment Mechanical Design Envelope Board-Level Components Keepout DimensionsTall Torsional Clip Heatsink Board Component Keepout Tall Torsional Clip Heatsink Thermal Solution AssemblyRetention Mechanism Component Keepout Zones Heatsink OrientationMechanical Interface Material Extruded Heatsink ProfilesThermal Interface Material Heatsink ClipClip Retention Anchors Reliability GuidelinesReliability Guidelines Sheet 1 Test Requirement Pass/Fail CriteriaReliability Guidelines Sheet 2 Reference Thermal Solution Reference Thermal Solution Motherboard Short Torsional Clip Heatsink Board Component Keepout Short Torsional Clip Heatsink Thermal Solution AssemblyShort Torsional Clip Heatsink Assembly Heatsink Clip Reference Thermal Solution Part Intel Part Number Supplier Contact Information Tall Torsional Clip Heatsink Thermal SolutionShort Torsional Clip Heatsink Thermal Solution Drawing Name Table B-1. Mechanical Drawing ListFigure B-1. Tall Torsional Clip Heatsink Assembly Drawing Figure B-2. Tall Torsional Clip Heatsink Drawing Sheet 1 Figure B-3. Tall Torsional Clip Heatsink Drawing Sheet 2 Figure B-4. Tall Torsional Clip Heatsink Clip Drawing Figure B-5. Short Torsional Clip Heatsink Assembly Drawing Figure B-6. Short Torsional Clip Heatsink DrawingSheet 1 Figure B-7. Short Torsional Clip Heatsink DrawingSheet 2 Figure B-8. Short Torsional Clip Heatsink Clip Drawing Mechanical Drawings
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