Cypress CY7C1141V18 manual Features, Functional Description, Configurations, Selection Guide

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CY7C1141V18, CY7C1156V18

CY7C1143V18, CY7C1145V18

18-Mbit QDR™-II+ SRAM 4-Word Burst Architecture (2.0 Cycle Read Latency)

Features

Separate Independent read and write data ports

Supports concurrent transactions

300 MHz to 375 MHz clock for high bandwidth

4-Word Burst for reducing address bus frequency

Double Data Rate (DDR) interfaces on both read and write ports (data transferred at 750 MHz) at 375 MHz

Read latency of 2.0 clock cycles

Two input clocks (K and K) for precise DDR timing

SRAM uses rising edges only

Echo clocks (CQ and CQ) simplify data capture in high speed systems

Single multiplexed address input bus latches address inputs for both read and write ports

Separate Port Selects for depth expansion

Data valid pin (QVLD) to indicate valid data on the output

Synchronous internally self-timed writes

Available in x8, x9, x18, and x36 configurations

Full data coherency providing most current data

Core VDD = 1.8V ± 0.1V; IO VDDQ = 1.4V to VDD[1]

Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)

Offered in both Pb-free and non Pb-free packages

Variable drive HSTL output buffers

JTAG 1149.1 compatible test access port

Delay Lock Loop (DLL) for accurate data placement

Functional Description

The CY7C1141V18, CY7C1156V18, CY7C1143V18, and CY7C1145V18 are 1.8V Synchronous Pipelined SRAMs, equipped with QDR™-II+ architecture. QDR-II+ architecture consists of two separate ports to access the memory array. The read port has dedicated data outputs to support read operations and the write port has dedicated data inputs to support write operations. QDR-II+ architecture has separate data inputs and data outputs to completely eliminate the need to “turn-around” the data bus required with common IO devices. Access to each port is accomplished through a common address bus. Addresses for read and write addresses are latched on alternate rising edges of the input (K) clock. Accesses to the QDR-II+ read and write ports are completely independent of one another. To maximize data throughput, both read and write ports are equipped with Double Data Rate (DDR) interfaces. Each address location is associated with four 8-bit words (CY7C1141V18), or 9-bit words (CY7C1156V18), or 18-bit words (CY7C1143V18), or 36-bit words (CY7C1145V18) that burst sequentially into or out of the device. Because data can be trans- ferred into and out of the device on every rising edge of both input clocks K and K, memory bandwidth is maximized while simpli- fying system design by eliminating bus “turn-arounds”.

Depth expansion is accomplished with Port Selects for each port. Port Selects enable each port to operate independently.

All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the K or K input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry.

Configurations

With Read Cycle Latency of 2.0 cycles:

CY7C1141V18 – 2M x 8

CY7C1156V18 – 2M x 9

CY7C1143V18 – 1M x 18

CY7C1145V18 – 512K x 36

Selection Guide

Description

375 MHz

333 MHz

300 MHz

Unit

Maximum Operating Frequency

375

333

300

MHz

 

 

 

 

 

Maximum Operating Current

1020

920

850

mA

 

 

 

 

 

Note

1.The QDR consortium specification for VDDQ is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting VDDQ = 1.4V to VDD.

Cypress Semiconductor Corporation • 198 Champion Court

San Jose, CA 95134-1709

408-943-2600

Document Number: 001-06583 Rev. *D

 

Revised March 06, 2008

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Contents Configurations FeaturesFunctional Description Selection GuideLogic Block Diagram CY7C1156V18 Logic Block Diagram CY7C1141V18Logic Block Diagram CY7C1145V18 Logic Block Diagram CY7C1143V18CY7C1141V18 2M x Pin ConfigurationsCY7C1156V18 2M x NC/144MCY7C1145V18 512K x CY7C1143V18 1M xWPS BWS WPS BWS RPSPin Name Pin Description Pin DefinitionsBWS2, BWS3 QvldPower Supply Inputs for the Outputs of the Device Power Supply Inputs to the Core of the DeviceTDO for Jtag TCK Pin for JtagRead Operations Functional OverviewWrite Operations Byte Write OperationsDepth Expansion Valid Data Indicator QvldProgrammable Impedance Echo ClocksSram #4 Application ExampleBUS Master OperationComments Write Cycle DescriptionsRemains unaltered During the data portion of a write sequenceDevice Write cycle descriptions of CY7C1145V18 follows.2Into the device. D359 remains unaltered Device. D80 and D3518 remains unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode Tap Controller State Diagram11 TAP Controller State DiagramTAP Electrical Characteristics TAP Controller Block DiagramTAP Controller Parameter Description Test Conditions Min Max UnitTAP Timing and Test Condition TAP AC Switching CharacteristicsScan Register Sizes Identification Register DefinitionsInstruction Codes Bit # Bump ID Boundary Scan OrderPower Up Sequence Power Up Sequence in QDR-II+ SramPower Up Waveforms DLL ConstraintsAC Electrical Characteristics Electrical CharacteristicsMaximum Ratings Operating RangeThermal Resistance CapacitanceAC Test Loads and Waveforms Parameter Description Test Conditions Max UnitCypress Consortium Description 375 MHz 333 MHz 300 MHz Unit Switching CharacteristicsParameter Min Max DLL TimingWaveform for 2.0 Cycle Read Latency 30, 31 Switching Waveforms Read/Write/Deselect SequenceOrdering Information DiagramSpeed Ordering Code Package Package Type Operating CY7C1156V18-375BZXI CY7C1143V18-375BZXI CY7C1145V18-375BZXI300 Ball Fbga 13 x 15 x 1.4 mm Package DiagramDocument History ECN No Issue Date Orig. Description of ChangeVKN/KKVTMP VKN/AESA