Cypress CY7C1141V18, CY7C1145V18, CY7C1143V18, CY7C1156V18 Ieee 1149.1 Serial Boundary Scan Jtag

Page 13

CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18

IEEE 1149.1 Serial Boundary Scan (JTAG)

These SRAMs incorporate a serial boundary scan test access port (TAP) in the FBGA package. This part is fully compliant with IEEE Standard #1149.1-2001. The TAP operates using JEDEC standard 1.8V IO logic levels.

Disabling the JTAG Feature

It is possible to operate the SRAM without using the JTAG feature. To disable the TAP controller, TCK must be tied LOW (VSS) to prevent clocking of the device. TDI and TMS are inter- nally pulled up and may be unconnected. They may alternately be connected to VDD through a pull up resistor. TDO must be left unconnected. Upon power up, the device comes up in a reset state which does not interfere with the operation of the device.

Test Access Port—Test Clock

The test clock is used only with the TAP controller. All inputs are captured on the rising edge of TCK. All outputs are driven from the falling edge of TCK.

Test Mode Select

The TMS input is used to give commands to the TAP controller and is sampled on the rising edge of TCK. It is allowable to leave this pin unconnected if the TAP is not used. The pin is pulled up internally, resulting in a logic HIGH level.

Test Data-In (TDI)

The TDI pin is used to serially input information into the registers and connect to the input of any of the registers. The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register. For information about loading the instruction register, see “TAP Controller State Diagram” on page 15 TDI is internally pulled up and unconnected if the TAP is unused in an application. TDI is connected to the most signif- icant bit (MSb) on any register.

Test Data-Out (TDO)

The TDO output pin is used to serially clock data-out from the registers. The output is active depending upon the current state of the TAP state machine (see “Instruction Codes” on page 18). The output changes on the falling edge of TCK. TDO is connected to the least significant bit (LSb) of any register.

Performing a TAP Reset

A Reset is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This RESET does not affect the operation of the SRAM and may be performed while the SRAM is operating. At power up, the TAP is reset internally to ensure that TDO comes up in a high-Z state.

TAP Registers

Registers are connected between the TDI and TDO pins and enable data to be scanned into and out of the SRAM test circuitry. Only one register can be selected at a time through the instruction registers. Data is serially loaded into the TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK.

Instruction Register

Serially load three-bit instructions into the instruction register. This register is loaded when it is placed between the TDI and TDO pins as shown in “TAP Controller Block Diagram” on page 16. Upon power up, the instruction register is loaded with the IDCODE instruction. It is also loaded with the IDCODE instruction if the controller is placed in a reset state as described in the previous section.

When the TAP controller is in the Capture IR state, the two least significant bits are loaded with a binary “01” pattern to enable for fault isolation of the board level serial test path.

Bypass Register

To save time when serially shifting data through registers, it is sometimes advantageous to skip certain chips. The bypass register is a single-bit register that can be placed between TDI and TDO pins. This enables data to be shifted through the SRAM with minimal delay. The bypass register is set LOW (VSS) when the BYPASS instruction is executed.

Boundary Scan Register

The boundary scan register is connected to all of the input and output pins on the SRAM. Several no connect (NC) pins are also included in the scan register to reserve pins for higher density devices.

The boundary scan register is loaded with the contents of the RAM input and output ring when the TAP controller is in the Capture-DR state and is then placed between the TDI and TDO pins when the controller is moved to the Shift-DR state. Use the EXTEST, SAMPLE/PRELOAD, and SAMPLE Z instructions to capture the contents of the input and output ring.

The “Boundary Scan Order” on page 19 shows the order in which the bits are connected. Each bit corresponds to one of the bumps on the SRAM package. The MSb of the register is connected to TDI, and the LSb is connected to TDO.

Identification (ID) Register

The ID register is loaded with a vendor-specific 32-bit code during the Capture-DR state when the IDCODE command is loaded in the instruction register. The IDCODE is hardwired into the SRAM and can be shifted out when the TAP controller is in the Shift-DR state. The ID register has a vendor code and other information described in the “Identification Register Definitions” on page 18.

TAP Instruction Set

Eight different instructions are possible with the three-bit instruction register. All combinations are listed in the “Instruction Codes” on page 18. Three of these instructions are listed as RESERVED and must not be used. The other five instructions are described in this section.

Instructions are loaded into the TAP controller during the Shift-IR state when the instruction register is placed between TDI and TDO. During this state, instructions are shifted through the instruction register through the TDI and TDO pins. To execute the instruction after it is shifted in, the TAP controller must be moved into the Update-IR state.

Document Number: 001-06583 Rev. *D

Page 13 of 28

[+] Feedback

Page 12 Page 14
Image 13
Page 12 Page 14
Contents Configurations FeaturesFunctional Description Selection GuideLogic Block Diagram CY7C1156V18 Logic Block Diagram CY7C1141V18Logic Block Diagram CY7C1145V18 Logic Block Diagram CY7C1143V18CY7C1141V18 2M x Pin ConfigurationsCY7C1156V18 2M x NC/144MCY7C1145V18 512K x CY7C1143V18 1M xWPS BWS WPS BWS RPSPin Name Pin Description Pin DefinitionsBWS2, BWS3 QvldPower Supply Inputs for the Outputs of the Device Power Supply Inputs to the Core of the DeviceTDO for Jtag TCK Pin for JtagRead Operations Functional OverviewWrite Operations Byte Write OperationsDepth Expansion Valid Data Indicator QvldProgrammable Impedance Echo ClocksSram #4 Application ExampleBUS Master OperationComments Write Cycle DescriptionsRemains unaltered During the data portion of a write sequenceDevice Write cycle descriptions of CY7C1145V18 follows.2Into the device. D359 remains unaltered Device. D80 and D3518 remains unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode Tap Controller State Diagram11 TAP Controller State DiagramTAP Electrical Characteristics TAP Controller Block DiagramTAP Controller Parameter Description Test Conditions Min Max UnitTAP Timing and Test Condition TAP AC Switching CharacteristicsScan Register Sizes Identification Register DefinitionsInstruction Codes Bit # Bump ID Boundary Scan OrderPower Up Sequence Power Up Sequence in QDR-II+ SramPower Up Waveforms DLL ConstraintsAC Electrical Characteristics Electrical CharacteristicsMaximum Ratings Operating RangeThermal Resistance CapacitanceAC Test Loads and Waveforms Parameter Description Test Conditions Max UnitCypress Consortium Description 375 MHz 333 MHz 300 MHz Unit Switching CharacteristicsParameter Min Max DLL TimingWaveform for 2.0 Cycle Read Latency 30, 31 Switching Waveforms Read/Write/Deselect SequenceOrdering Information DiagramSpeed Ordering Code Package Package Type Operating CY7C1156V18-375BZXI CY7C1143V18-375BZXI CY7C1145V18-375BZXI300 Ball Fbga 13 x 15 x 1.4 mm Package DiagramDocument History ECN No Issue Date Orig. Description of ChangeVKN/KKVTMP VKN/AESA
Top Page Image Contents