CY7C1141V18, CY7C1156V18
CY7C1143V18, CY7C1145V18
Package Diagram
Figure 8. 165-Ball FBGA (13 x 15 x 1.4 mm), 51-85180
15.00±0.10
A
TOP VIEW
PIN 1 CORNER
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 |
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
15.00±0.10
A
BOTTOM VIEW
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| PIN 1 CORNER | |||
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| Ø0.05 M C |
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| Ø0.25 M C A B |
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| Ø0.50 | (165X) |
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| +0.14 |
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11 | 10 | 9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1 |
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| A |
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| B |
1.00 |
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| C |
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| D | |
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| E |
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| F |
14.00 |
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| G |
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| H | |
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| J |
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| K |
7.00 |
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| L |
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| M | |
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| N |
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| P |
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| R |
1.00 |
5.00 |
10.00 |
0.25 C
| B |
0.53±0.05 |
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0.36 | C |
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13.00±0.10
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| 1.40MAX. |
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| 0.15C | |||||
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SEATING PLANE
0.35±0.06
B 13.00±0.10
0.15(4X)
NOTES :
SOLDER PAD TYPE :
PACKAGE WEIGHT : 0.475g
JEDEC REFERENCE :
Document Number: | Page 27 of 28 |
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