Cypress CY7C1310BV18 manual Features, Functional Description, Configurations, Selection Guide

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CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18

18-Mbit QDR™-II SRAM 2-Word Burst Architecture

Features

Separate independent read and write data ports

Supports concurrent transactions

250 MHz clock for high bandwidth

2-word burst on all accesses

Double Data Rate (DDR) interfaces on both read and write ports (data transferred at 500 MHz) at 250 MHz

Two input clocks (K and K) for precise DDR timing

SRAM uses rising edges only

Two input clocks for output data (C and C) to minimize clock skew and flight time mismatches

Echo clocks (CQ and CQ) simplify data capture in high-speed systems

Single multiplexed address input bus latches address inputs for both read and write ports

Separate port selects for depth expansion

Synchronous internally self-timed writes

Available in x8, x9, x18, and x36 configurations

Full data coherency, providing most current data

Core VDD = 1.8V (±0.1V); IO VDDQ = 1.4V to VDD

Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)

Offered in both Pb-free and non Pb-free packages

Variable drive HSTL output buffers

JTAG 1149.1 compatible test access port

Delay Lock Loop (DLL) for accurate data placement

Functional Description

The CY7C1310BV18, CY7C1910BV18, CY7C1312BV18, and CY7C1314BV18 are 1.8V Synchronous Pipelined SRAMs, equipped with QDR™-II architecture. QDR-II architecture consists of two separate ports: the read port and the write port to access the memory array. The read port has data outputs to support read operations and the write port has data inputs to support write operations. QDR-II architecture has separate data inputs and data outputs to completely eliminate the need to “turn-around” the data bus required with common IO devices. Access to each port is accomplished through a common address bus. The read address is latched on the rising edge of the K clock and the write address is latched on the rising edge of the K clock. Accesses to the QDR-II read and write ports are completely independent of one another. To maximize data throughput, both read and write ports are provided with DDR interfaces. Each address location is associated with two 8-bit words (CY7C1310BV18), 9-bit words (CY7C1910BV18), 18-bit words (CY7C1312BV18), or 36-bit words (CY7C1314BV18) that burst sequentially into or out of the device. Because data can be trans- ferred into and out of the device on every rising edge of both input clocks (K and K and C and C), memory bandwidth is maximized while simplifying system design by eliminating bus “turn-arounds”.

Depth expansion is accomplished with port selects, which enables each port to operate independently.

All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the C or C (or K or K in a single clock domain) input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry.

Configurations

CY7C1310BV18 – 2M x 8

CY7C1910BV18 – 2M x 9

CY7C1312BV18 – 1M x 18

CY7C1314BV18 – 512K x 36

Selection Guide

Description

 

250 MHz

200 MHz

167 MHz

Unit

Maximum Operating Frequency

 

250

200

167

MHz

 

 

 

 

 

 

Maximum Operating Current

x8

735

630

550

mA

 

 

 

 

 

 

 

x9

735

630

550

 

 

 

 

 

 

 

 

x18

800

675

600

 

 

 

 

 

 

 

 

x36

900

750

650

 

 

 

 

 

 

 

Cypress Semiconductor Corporation • 198 Champion Court

San Jose, CA 95134-1709

408-943-2600

Document #: 38-05619 Rev. *F

 

 

Revised June 2, 2008

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Contents Configurations FeaturesFunctional Description Selection GuideLogic Block Diagram CY7C1910BV18 Logic Block Diagram CY7C1310BV18Doff Logic Block Diagram CY7C1314BV18 Logic Block Diagram CY7C1312BV18Ball Fbga 13 x 15 x 1.4 mm Pinout Pin ConfigurationCY7C1310BV18 2M x CY7C1910BV18 2M xWPS BWS CY7C1312BV18 1M xCY7C1314BV18 512K x NC/72M NC/36MPin Name Pin Description Pin DefinitionsPower Supply Inputs for the Outputs of the Device Power Supply Inputs to the Core of the DeviceReferenced with Respect to TDO for JtagFunctional Overview Programmable Impedance Application ExampleEcho Clocks Sram #1Write Cycle Descriptions Truth TableOperation CommentsWrite cycle description table for CY7C1314BV18 follows Write cycle description table for CY7C1910BV18 followsDevice Into the device. D359 remains unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode State diagram for the TAP controller follows TAP Controller State DiagramTAP Electrical Characteristics TAP Controller Block DiagramTAP Timing and Test Conditions TAP AC Switching CharacteristicsScan Register Sizes Identification Register DefinitionsInstruction Codes Register Name Bit SizeBit # Bump ID Boundary Scan OrderPower Up Sequence Power Up Sequence in QDR-II SramDLL Constraints DC Electrical Characteristics Electrical CharacteristicsMaximum Ratings Input High Voltage Vref + AC Electrical CharacteristicsInput LOW Voltage Vref Document # 38-05619 Rev. *F Thermal Resistance CapacitanceParameter Description Test Conditions Max Unit Parameter Description Test Conditions Fbga UnitCypress Consortium Description 250 MHz 200 MHz 167 MHz Unit Switching CharacteristicsParameter Min Max DLL TimingRead/Write/Deselect Sequence 26, 27 Switching WaveformsOrdering Information 167 Ball Fbga 13 x 15 x 1.4 mm Package DiagramSYT Document HistoryNXR Worldwide Sales and Design Support Products PSoC Solutions Sales, Solutions, and Legal InformationVKN VKN/PYRS