Cypress CY7C1910BV18, CY7C1314BV18, CY7C1310BV18 manual Package Diagram, Ball Fbga 13 x 15 x 1.4 mm

Page 27

CY7C1310BV18, CY7C1910BV18

CY7C1312BV18, CY7C1314BV18

Package Diagram

Figure 6. 165-Ball FBGA (13 x 15 x 1.4 mm), 51-85180

15.00±0.10

A

TOP VIEW

PIN 1 CORNER

1

2

3

4

5

6

7

8

9

10

11

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

1.00

15.00±0.10

14.00

 

7.00

A

BOTTOM VIEW

PIN 1 CORNER

Ø0.05 M C

Ø0.25 M C A B

-0.06

Ø0.50 (165X)

+0.14

11

10

9

8

7

6

5

4

3

2

1

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

1.00

5.00

10.00

0.25 C

 

B

0.53±0.05

 

0.36

C

 

13.00±0.10

 

 

1.40MAX.

 

 

 

 

 

 

 

 

 

0.15C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SEATING PLANE

0.35±0.06

B 13.00±0.10

0.15(4X)

NOTES :

SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)

PACKAGE WEIGHT : 0.475g

JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE CODE : BB0AC

51-85180-*A

Document #: 38-05619 Rev. *F

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Contents Selection Guide FeaturesConfigurations Functional DescriptionLogic Block Diagram CY7C1310BV18 Logic Block Diagram CY7C1910BV18Doff Logic Block Diagram CY7C1314BV18 Logic Block Diagram CY7C1312BV18CY7C1910BV18 2M x Pin ConfigurationBall Fbga 13 x 15 x 1.4 mm Pinout CY7C1310BV18 2M xNC/72M NC/36M CY7C1312BV18 1M xWPS BWS CY7C1314BV18 512K xPin Name Pin Description Pin DefinitionsTDO for Jtag Power Supply Inputs to the Core of the DevicePower Supply Inputs for the Outputs of the Device Referenced with Respect toFunctional Overview Sram #1 Application ExampleProgrammable Impedance Echo ClocksComments Truth TableWrite Cycle Descriptions OperationInto the device. D359 remains unaltered Write cycle description table for CY7C1910BV18 followsWrite cycle description table for CY7C1314BV18 follows DeviceIeee 1149.1 Serial Boundary Scan Jtag Idcode State diagram for the TAP controller follows TAP Controller State DiagramTAP Electrical Characteristics TAP Controller Block DiagramTAP Timing and Test Conditions TAP AC Switching CharacteristicsRegister Name Bit Size Identification Register DefinitionsScan Register Sizes Instruction CodesBit # Bump ID Boundary Scan OrderPower Up Sequence in QDR-II Sram Power Up SequenceDLL Constraints Electrical Characteristics DC Electrical CharacteristicsMaximum Ratings AC Electrical Characteristics Input High Voltage Vref +Input LOW Voltage Vref Document # 38-05619 Rev. *F Parameter Description Test Conditions Fbga Unit CapacitanceThermal Resistance Parameter Description Test Conditions Max UnitDLL Timing Switching CharacteristicsCypress Consortium Description 250 MHz 200 MHz 167 MHz Unit Parameter Min MaxRead/Write/Deselect Sequence 26, 27 Switching WaveformsOrdering Information 167 Ball Fbga 13 x 15 x 1.4 mm Package DiagramDocument History SYTNXR VKN/PYRS Sales, Solutions, and Legal InformationWorldwide Sales and Design Support Products PSoC Solutions VKN