Cypress CY7C1310BV18 manual Application Example, Programmable Impedance, Echo Clocks, Sram #1

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CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18

Programmable Impedance

An external resistor, RQ, must be connected between the ZQ pin on the SRAM and VSS to allow the SRAM to adjust its output driver impedance. The value of RQ must be 5x the value of the intended line impedance driven by the SRAM. The allowable range of RQ to guarantee impedance matching with a tolerance of ±15% is between 175Ω and 350Ω, with VDDQ = 1.5V. The output impedance is adjusted every 1024 cycles upon power up to account for drifts in supply voltage and temperature.

Echo Clocks

Echo clocks are provided on the QDR-II to simplify data capture on high-speed systems. Two echo clocks are generated by the QDR-II. CQ is referenced with respect to C and CQ is referenced with respect to C. These are free-running clocks and are

synchronized to the output clock (C/C) of the QDR-II. In single clock mode, CQ is generated with respect to K and CQ is generated with respect to K. The timing for the echo clocks is shown in the Switching Characteristics on page 23.

DLL

These chips use a Delay Lock Loop (DLL) that is designed to function between 120 MHz and the specified maximum clock frequency. During power up, when the DOFF is tied HIGH, the DLL is locked after 1024 cycles of stable clock. The DLL can also be reset by slowing or stopping the input clock K and K for a minimum of 30 ns. However, it is not necessary to reset the DLL to lock to the desired frequency. The DLL automatically locks 1024 clock cycles after a stable clock is presented. The DLL may be disabled by applying ground to the DOFF pin. For information refer to the application note AN5062, DLL Considerations in QDRII/DDRII/QDRII+/DDRII+.

Application Example

 

 

 

 

 

 

 

 

 

 

Figure 1 shows two QDR-II used in an application.

 

 

 

 

 

 

 

 

 

 

 

Figure 1. Application Example

 

 

 

 

 

 

 

 

SRAM #1

ZQ

R = 250ohms

 

SRAM #2

ZQ

R = 250ohms

 

Vt

 

R W B

 

CQ/CQ#

 

R W B

 

CQ/CQ#

 

 

D

P P W

 

Q

D

P

P W

 

Q

 

 

 

 

 

 

 

 

S S S

 

S

S S

 

 

 

R

 

 

 

 

 

 

 

 

A

# # #

C C# K K#

A

# # #

C C# K K#

 

 

DATA IN

 

 

 

 

 

 

 

 

 

 

 

DATA OUT

 

 

 

 

 

Vt

 

 

 

 

 

Address

 

 

 

 

 

Vt

 

 

 

 

BUS

RPS#

 

 

 

 

 

R

 

 

 

 

 

 

 

 

 

 

 

 

 

 

WPS#

 

 

 

 

 

 

 

 

 

 

MASTER

 

 

 

 

 

 

 

 

 

 

BWS#

 

 

 

 

 

 

 

 

 

 

(CPU

 

 

 

 

 

 

 

 

 

 

CLKIN/CLKIN#

 

 

 

 

 

 

 

 

 

 

or

Source K

 

 

 

 

 

 

 

 

 

 

ASIC)

 

 

 

 

 

 

 

 

 

 

Source K#

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Delayed K

 

 

 

 

 

 

 

 

 

 

 

Delayed K#

 

 

 

 

 

 

 

 

 

 

 

R

R = 50ohms

Vt = Vddq/2

 

 

 

 

 

 

 

Document #: 38-05619 Rev. *F

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Contents Configurations FeaturesFunctional Description Selection GuideLogic Block Diagram CY7C1310BV18 Logic Block Diagram CY7C1910BV18Doff Logic Block Diagram CY7C1314BV18 Logic Block Diagram CY7C1312BV18Ball Fbga 13 x 15 x 1.4 mm Pinout Pin ConfigurationCY7C1310BV18 2M x CY7C1910BV18 2M xWPS BWS CY7C1312BV18 1M xCY7C1314BV18 512K x NC/72M NC/36MPin Name Pin Description Pin DefinitionsPower Supply Inputs for the Outputs of the Device Power Supply Inputs to the Core of the DeviceReferenced with Respect to TDO for JtagFunctional Overview Programmable Impedance Application ExampleEcho Clocks Sram #1Write Cycle Descriptions Truth TableOperation CommentsWrite cycle description table for CY7C1314BV18 follows Write cycle description table for CY7C1910BV18 followsDevice Into the device. D359 remains unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode State diagram for the TAP controller follows TAP Controller State DiagramTAP Electrical Characteristics TAP Controller Block DiagramTAP Timing and Test Conditions TAP AC Switching CharacteristicsScan Register Sizes Identification Register DefinitionsInstruction Codes Register Name Bit SizeBit # Bump ID Boundary Scan OrderPower Up Sequence in QDR-II Sram Power Up SequenceDLL Constraints Electrical Characteristics DC Electrical CharacteristicsMaximum Ratings AC Electrical Characteristics Input High Voltage Vref +Input LOW Voltage Vref Document # 38-05619 Rev. *F Thermal Resistance CapacitanceParameter Description Test Conditions Max Unit Parameter Description Test Conditions Fbga UnitCypress Consortium Description 250 MHz 200 MHz 167 MHz Unit Switching CharacteristicsParameter Min Max DLL TimingRead/Write/Deselect Sequence 26, 27 Switching WaveformsOrdering Information 167 Ball Fbga 13 x 15 x 1.4 mm Package DiagramDocument History SYTNXR Worldwide Sales and Design Support Products PSoC Solutions Sales, Solutions, and Legal InformationVKN VKN/PYRS