CY7C1292DV18
CY7C1294DV18
Package Diagram
165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D
15.00±0.10
15.00±0.10
TOP VIEW
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| TOP VIEW |
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| PIN 1 CORNER |
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| PIN 1 CORNER |
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| 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 |
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A |
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| 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 |
B | A |
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CB
DC
ED
FE
GF
HG
JH
KJ
LK
ML
NM
PN
RP R
15.00±0.10 | 15.00±0.10 |
| 14.00 |
1.00 | 1.00 |
14.00 |
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7.00 | 7.00 |
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| BOTTOM VIEW |
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| BOTTOM VIEWPIN 1 CORNER |
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| PIN 1 CORNER | |||
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| Ø0.05 M C |
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| Ø0.05 M C |
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| Ø0.25 M C A B |
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| Ø0.50 | .25 M C A B |
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| (165X) |
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| +0.14 |
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11 | 10 | 9 | 8 | 7 | 6 | 5 | Ø0.50 | (165X) |
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4 | 3 | 2 | 1 |
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| +0.14 |
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| 11 | 10 | 9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1A | ||
BA
CB
DC
ED
FE
GF
HG
JH
KJ
LK
ML
NM
PN
RP
R
A
0.25 C
A
0.3600.25.3±0C .05
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| A |
| 5.00 | 1.00 | |
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| A |
| 1.00 | ||
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| 5.00 | |
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| 10.00 | |
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| 10.00 | |
B | 13.00±0.10 |
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| B | 13.00±0.10 | ||
B | 13.00±0.10 |
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| B |
| 13.00±0.10 | |
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| 0.15(4X) |
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| 1.40 MAX. |
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| 0.15(4X) |
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| 1.40MAX. |
| NOTES : |
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0.53±0.05 | 0.15 C | 0.15C | SOLDERNOTESPAD TYPE: | : | ||||
PACKAGESOLDERW IGHTPAD: 0TYPE.475g: | ||||||||
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| JEDEC REFERENCEPACKAGE WEIGHT: | |||
PACKAGEJEDECODEREFERENCE: BB0AC :
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| SEATING PLANE |
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| PACKAGE CODE : BB0AC | ||
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| C |
| SEATING PLANE |
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0.36 |
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| C | 0.35±0.06 | 0.35±0.06 | ||
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QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress, Hitachi, IDT, NEC, and Samsung. All product and company names mentioned in this document are the trademarks of their respective holders.
Document #: | Page 22 of 23 |
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in
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