Cypress CY7C1292DV18 manual Features, Functional Description, Configurations, Selection Guide

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CY7C1292DV18

CY7C1294DV18

Features

Separate Independent Read and Write data ports

Supports concurrent transactions

250-MHz clock for high bandwidth

2-Word Burst on all accesses

Double Data Rate (DDR) interfaces on both Read and Write ports (data transferred at 500 MHz) @ 250 MHz

Two input clocks (K and K) for precise DDR timing

SRAM uses rising edges only

Two input clocks for output data (C and C) to minimize clock-skew and flight-time mismatches

Echo clocks (CQ and CQ) simplify data capture in high-speed systems

Single multiplexed address input bus latches address inputs for both Read and Write ports

Separate Port Selects for depth expansion

Synchronous internally self-timed writes

Available in x 18 and x 36 configurations

Full data coherency, providing most current data

Core VDD = 1.8V (±0.1V); I/O VDDQ = 1.4V to VDD

Available in 165-ball FBGA package (13 x 15 x 1.4 mm)

Offered in both lead-free and non-lead free packages

Variable drive HSTL output buffers

JTAG 1149.1 compatible test access port

Delay Lock Loop (DLL) for accurate data placement

9-Mbit QDR- II™ SRAM 2-Word Burst Architecture

Functional Description

The CY7C1292DV18 and CY7C1294DV18 are 1.8V Synchronous Pipelined SRAMs, equipped with QDR™-II architecture. QDR-II architecture consists of two separate ports to access the memory array. The Read port has dedicated Data Outputs to support Read operations and the Write Port has dedicated Data Inputs to support Write opera- tions. QDR-II architecture has separate data inputs and data outputs to completely eliminate the need to “turn-around” the data bus required with common I/O devices. Access to each port is accomplished through a common address bus. The Read address is latched on the rising edge of the K clock and the Write address is latched on the rising edge of the K clock. Accesses to the QDR-II Read and Write ports are completely independent of one another. In order to maximize data throughput, both Read and Write ports are equipped with Double Data Rate (DDR) interfaces. Each address location is associated with two 18-bit words (CY7C1292DV18) or 36-bit words (CY7C1294DV18) that burst sequentially into or out of the device. Since data can be transferred into and out of the device on every rising edge of both input clocks (K and K and C and C), memory bandwidth is maximized while simplifying system design by eliminating bus “turn-arounds.”

Depth expansion is accomplished with Port Selects for each port. Port selects allow each port to operate independently.

All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the C or C (or K or K in a single clock domain) input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry.

Configurations

CY7C1292DV18 – 512K x 18

CY7C1294DV18 – 256K x 36

Selection Guide

 

250 MHz

200 MHz

167 MHz

Unit

Maximum Operating Frequency

250

200

167

MHz

 

 

 

 

 

Maximum Operating Current

600

550

500

mA

 

 

 

 

 

Cypress Semiconductor Corporation

198 Champion Court • San Jose, CA 95134-1709

408-943-2600

Document #: 001-00350 Rev. *A

 

Revised July 20, 2006

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Contents Configurations FeaturesFunctional Description Selection GuideLogic Block Diagram CY7C1294DV18 Logic Block Diagram CY7C1292DV18Doff TMS TDI Pin Configurations Ball Fbga 13 x 15 x 1.4 mm PinoutQ34 Pin Definitions Functional Overview DLL Write Cycle Descriptions CY7C1292DV18 2 Application Example1RPS WPS BWSWrite Cycle Descriptions CY7C1294DV18 2 Ieee 1149.1 Serial Boundary Scan Jtag Idcode EXIT2-IR UPDATE-DR UPDATE-IR TAP Controller State Diagram9Parameter Description Test Conditions Min Max Unit TAP Controller Block DiagramTAP Timing and Test Conditions13 TAP AC Switching Characteristics Over the Operating Range13Parameter Description Min Max Unit Hold TimesScan Register Sizes Identification Register DefinitionsInstruction Codes Register Name Bit SizeBit # Bump ID Boundary Scan OrderPower-up Waveforms Power-Up Sequence in QDR-II SramPower-Up Sequence DLL ConstraintsMaximum Ratings Electrical Characteristics Over the Operating Range12Operating Range CapacitanceAC Test Loads and Waveforms Thermal Resistance21Parameter Description Test Conditions Fbga Unit Test conditions follow standard test 28.51Set-up Times Switching Characteristics Over the Operating Range22Output Times DLL TimingRead/Write/Deselect Sequence Switching Waveforms27, 28Write Read Write NOPOrdering Information PIN 1 Corner Package DiagramDocument History ECN No Issue Date Orig. Description of ChangeREV SYT